A method for controlling a pneumatic scraper head of a silicon wafer printing machine

Abstract

The invention discloses a method for controlling a pneumatic scraper head of a silicon wafer printing machine, comprising the following steps: A) setting a cylinder on a cylinder mounting seat, installing an elastic scraper seat at the end of a piston rod of the cylinder, An electric proportional valve is set on the gas pipeline, and the electric proportional valve is controlled by a control system; B) An electric control device is set on the scraper seat to control the movement of the scraper seat up and down; C) When it is necessary to position and print the PCB board, the control The system controls the action of the electronic control device, and after the scraper seat moves down to a certain height, the control system controls the electric proportional valve, and makes the cylinder push the scraper seat down; D) When the pressure of the scraper seat is pressed down and the pressure set by the control system has When there is a deviation, the control system controls the electric proportional valve to adjust the intake ratio; E) When the downward pressure of the scraper seat reaches a suitable state, the control system controls the X, Y axis moving device to control the scraper head to start printing. The method has the advantages of simple steps, easy implementation, convenient control of the pressing pressure of the scraper, and the like.

Description

technical field [0001] The invention relates to the technology of a silicon wafer printing machine, in particular to a method for controlling a pneumatic scraper head of a silicon wafer printing machine. Background technique [0002] At present, the scraper head on the silicon wafer printing machine is driven by a motor or a motor, so that the scraper head moves up and down, back and forth, and left and right to scrape the silicon wafer. It is difficult to control the pressure when pressing down. If the pressure is too high, the silicon wafer will be deformed or damaged. If the pressure is too small, the scraping will not be in place. In this way, the yield rate will be greatly reduced. Moreover, when it is necessary to adjust the thickness of the scraper to scrape the solder paste, It is difficult to control the blade height and pressure of the scraper. Contents of the invention [0003] The object of the present invention is to aim at the above-mentioned defects of the ...

AI Technical Summary

Problems solved by technology

[0002] At present, the scraper head on the silicon wafer printing machine is driven by a motor or a motor, so that the scraper head moves up and down, back and forth, and left and right to scrape the silicon wafer. It is difficult to control the pressure when pressing down. If the pressure is too high, the silicon wafer will be deformed or damaged. If the pressure is too small, the scraping will not be in place. In this way, the yield rate will be greatly reduced. Moreover, when it is necessary to adjust the thickness of the solder paste with the scraper, Difficult to control the lower blade height and pressure of the scraper