Organic silicon pouring sealant for LEDs and preparation method for organic silicon pouring sealant

Abstract

The invention relates to an organic silicon pouring sealant for LEDs. The organic silicon pouring sealant for LEDs is characterized by comprising the following components (in parts by weight): 90-100 parts of low-viscosity 107 glue, 1-5 parts of hydroxyl end-capping silicone oil, 2-5 parts of methyl silicone oil, 1-5 parts of methyl fluorosilicone oil , 5-10 parts of a cross-linking agent, 1-5 parts of a cross-linking agent and 1-5 parts of a catalyst. The preparation method comprises: adding the low-viscosity 107 glue, the hydroxyl end-capping silicone oil, the methyl silicone oil and the methyl fluorosilicone oil into a stirrer in formula to be stirred for 30 minutes at a high speed, and carrying out vacuum pumping to remove air bubbles to obtain a mixture II; taking the mixture I as base glue; adding the cross-linking agent, the coupling agent and the catalyst according to the formula to be uniformly mixed to obtain a mixture II, and taking the mixture II as an auxiliary gent; and uniformly mixing the base glue with the auxiliary agent in a ratio of the base glue to the auxiliary agent being 10:1, thereby obtaining the organic silicon pouring sealant for LEDs. The organic silicon pouring sealant disclosed by the invention is excellent in bonding force, high in transparency, good in bubble discharge, quick in deep-layer curing and free of yellowing. The organic silicon pouring sealant can be used for protecting the LEDs from invasion of the external environment for a long time.

Description

technical field [0001] The invention relates to a silicone potting glue, in particular to a silicone potting glue for LEDs and a manufacturing method thereof. Background technique [0002] LED is a solid-state semiconductor device that converts electrical energy into visible light. Its luminous efficiency can reach 80%-90%. It is a new type of high efficiency and has the advantages of energy saving, environmental protection and long service life. Long-term exposure of LED chips to harsh and harsh environments is vulnerable to high humidity, high temperature, dust, microorganisms, ray radiation, wind and rain, etc. It is easy to cause a decrease in luminous rate, and serious permanent oxidative damage; followed by external physical Shock and vibration cause physical damage. Therefore, in order to achieve industrial application, it is required to be potted and protected, so that the circuit board and LED are in a stable and safe environment. [0003] Silicone potting adhesiv...

AI Technical Summary

Problems solved by technology

However, there are some problems in the use of silicone potting adhesives, such as easy to generate air bubbles during use, which affects the light output rate of LEDs; poor adhesion to materials, which affects the airtightness of potting; deep curing speed Slow, affecting production efficiency; yellowing during use, affecting luminous color, etc.