Method and apparatus of separating substrate from light emitting assembly
A technology for light-emitting components and substrates, which is applied to electrical components, semiconductor devices, laser welding equipment, etc., can solve the problems of low yield rate of laser stripping, and achieve the effect of improving yield rate
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0033] An embodiment of the present invention provides a method for peeling off the substrate of the light-emitting component, the flow chart of the method is as follows figure 1 shown, including:
[0034] S101: providing a light-emitting component to be stripped;
[0035] refer to figure 2 , the light-emitting component to be stripped includes a first substrate 20, a gallium nitride epitaxial layer 21 on one side of the first substrate 20, and a metal subs...
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