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An anti-splash and anti-adhesion type process cavity for a track machine uniforming unit

A process chamber and anti-adhesion technology, which is applied in the field of process chambers, can solve problems such as backsplash and photoresist adhesion, and achieve the effects of reducing adhesion, improving performance, and increasing production capacity

Active Publication Date: 2017-12-15
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process chamber solves the problem of backsplash after the glue droplet collides with the process chamber (also known as CUP) during the uniform glue process, and solves the problem of photoresist sticking to the inner wall of the CUP through special surface treatment

Method used

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  • An anti-splash and anti-adhesion type process cavity for a track machine uniforming unit
  • An anti-splash and anti-adhesion type process cavity for a track machine uniforming unit
  • An anti-splash and anti-adhesion type process cavity for a track machine uniforming unit

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Such as Figure 1-3 As shown, the present invention includes an upper process chamber 2, a middle process chamber 3 and a lower process chamber 4, and the upper process chamber 2 and the middle process chamber 3 cooperate with the lower process chamber 4 respectively to form a whole. The upper process chamber inner surface 10 of the upper process chamber 2 is provided with an anti-splash groove 5 and coated with a hydrophilic layer.

[0021] Such as Figure 4 As shown, the anti-backlash tank 5 includes an upper back-splash tank and a lower back-splash tank, and the upper back-splash tank and the lower back-splash tank are along the upper process chamber inner surface 10 The grooves are concave upwards from top to bottom, and the wafer 1 is located between the lower edge 6 of the upper anti-splash groove and the lower edge 8 of the lower anti-splash groove. Th...

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Abstract

The invention relates to a process cavity of a glue leveling unit, specifically an anti-splash and anti-adhesion type process cavity of a TRACK machine platform glue leveling unit, including an upper process cavity, a middle process cavity and a lower process cavity. The process chamber, the upper process chamber and the middle process chamber respectively cooperate with the lower process chamber to form a whole, and the inner surface of the upper process chamber is provided with an anti-splash groove and coated with a hydrophilic layer. The anti-splash tank includes an upper anti-splash tank and a lower anti-splash tank that are concave upwards from top to bottom along the inner surface of the upper process chamber, and the wafer is located at the lowermost edge and lower part of the upper back-splash tank Between the lowermost edges of the backsplash tank. The invention effectively prevents backsplash when the photoresist collides with the CUP, reduces the adhesion of the photoresist on the inner wall of the CUP by changing the hydrophilic and hydrophobic characteristics of the inner wall of the CUP, and can effectively improve the performance of the uniform glue unit.

Description

technical field [0001] The invention relates to a process cavity of a glue leveling unit, in particular to an anti-splash and anti-adhesion type process cavity of the glue leveling unit of TRACK machine, which is applied to the glue leveling unit in TRACK machine of semiconductor equipment . Background technique [0002] TRACK is one of the core equipments of lithography process in the field of semiconductor manufacturing, and the internal glue leveling unit is its important functional unit. In the glue leveling unit, the process chamber (also called CUP) is the core component, which directly affects the effect of the glue leveling process. During TRACK’s homogenization process, most of the photoresist dropped on the wafer surface will break away from the wafer due to the centrifugal force during the high-speed rotation of the wafer and be thrown into the CUP. After the photoresist is detached from the wafer, it will collide with the inner wall of the CUP. After the collis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
Inventor 刘莹
Owner SHENYANG KINGSEMI CO LTD
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