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Heat conduction transparent modification process of epoxy resin for LED packaging

An epoxy resin and modification technology, which is applied in the field of thermal conductivity and transparent modification process of epoxy resin for LED packaging, can solve the problems such as the inability of graphite to be used.

Inactive Publication Date: 2015-09-09
合肥卓元科技服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many studies on using graphite to improve the thermal conductivity of polymer materials, but graphite cannot be used as a thermally conductive modified filler for LED packaging plastics because it is a non-electrically insulating material

Method used

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Examples

Experimental program
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Embodiment Construction

[0012] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the invention.

[0013] Thermally conductive and transparent modification process of epoxy resin for LED packaging. The process adopts the precipitation transformation method, using brine and sodium carbonate as raw materials, and polyvinyl alcohol (PVA) as a modifier to prepare nano-magnesia particles with good dispersion. Using nano-MgO (magnesium oxide) as filler, adding epoxy resin to the AB glue curing system to enhance the thermal conductivity of the cured product, the steps of preparing nano-magnesia particles and modifying and curing epoxy resin are:

[0014] (1) Preparation of nano magnesium oxide particles;

[0015] Prepare...

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PUM

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Abstract

The invention discloses a heat conduction transparent modification process of epoxy resin for LED packaging. According to the process, a precipitate conversion method is adopted, brine and sodium carbonate are taken as raw materials, polyving alcohol (PVA) is taken as a modifier, and nano magnesium oxide particles with relatively good dispersity can be prepared. As nano magnesium oxide MgO (magnesium oxide) is taken as packing which is added into an epoxy resin AB adhesive curing system, the heat conduction property of a cured article can be improved. After PVA is added in the process, the experiment shows that the prepared nano magnesium oxide MgO particles are free of conspicuous agglomeration and relatively good in dispersity, and as the particles are sphere-shaped, the heat conduction property of epoxy resin is improved, and the light permeability of an epoxy resin cured article can be improved.

Description

technical field [0001] The invention discloses a thermally conductive and transparent modification process of epoxy resin for LED packaging. Background technique [0002] At present, most of the AB compound adhesives used in the production of LED packaging resins are only suitable for low-power LED packaging. The thermal conductivity and transparency modification of the existing AB glue components can meet the requirements of high-power LED packaging. The vast majority of polymer materials themselves are heat-insulating materials. To obtain materials with excellent thermal conductivity, the first way is to manufacture polymer materials with high thermal conductivity; the second way is to fill polymer materials by blending methods. Modification to form composite materials and improve thermal conductivity of polymers. The second way is simpler, feasible and more common. Commonly used thermally conductive fillers usually include metal powders and inorganic materials. In ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/04C08K3/22
Inventor 任磊
Owner 合肥卓元科技服务有限公司
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