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Cabinet and cooling system

A technology of cabinets and heat dissipation substrates, applied in cooling/ventilation/heating renovation, data centers, electrical components, etc., can solve the problems of high energy consumption and expensive data centers, reduce energy consumption, improve heat dissipation efficiency, and improve energy efficiency The effect of using efficiency

Active Publication Date: 2015-07-29
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, general-purpose servers and customized servers generally use air conditioners to dissipate heat in the data center, but cooling the air with air conditioners is expensive, which will lead to excessive energy consumption in the data center

Method used

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0040] The terms "first", "second", "third" and "fourth" in the specification and claims of the present invention and the above drawings are used to distinguish different objects, rather than to describe a specific order.

[0041] figure 1 is a schematic plan view of a cabinet 100 according to an embodiment of the present invention. The cabinet 100 can be used to dissipate heat from servers in a data center. Such as figure 1As shown, the cabinet 100 inc...

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Abstract

The embodiment of the invention provides a cabinet and a cooling system. The cabinet comprises a working cabin and a cooling cabin, wherein the working cabin is arranged on one side of a cooling substrate, and used for accommodating a server; the cooling cabin is arranged on the other side of the cooling substrate, the cooling cabin and the working cabin share the cooling substrate serving as a cabin wall, the working cabin and the cooling cabin are isolated by the cooling substrate, a plurality of cooling fins are accommodated in the cooling cabin and connected with the cooling substrate, the cooling substrate is used for conducting heat generated by the server in the working cabin to the plurality of cooling fins, an air inlet is formed in the first side cabin wall of the cooling cabin, an air outlet is formed in the second side cabin wall of the cooling cabin, and thereby natural air enters the cooling cabin from the air inlet, passes through the plurality of cooling fins and then discharges heat on the plurality of cooling fins by the air outlet; the first side cabin wall and the second side cabin wall are the cabin walls besides the cooling substrate in the cooling cabin. According to the cabinet provided by the embodiment of the invention, the server is cooled by natural air, the cooling efficiency can be improved, energy consumption can be reduced, and thereby the energy use efficiency can be improved.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a cabinet and a cooling system. Background technique [0002] At present, general-purpose servers and customized servers generally use air conditioners to dissipate heat in data centers, but cooling air with air conditioners is expensive, which will lead to excessive energy consumption of data centers. At present, the PUE value (Power Usage Effectiveness, energy usage efficiency index) of a general traditional data center is about 2.0, and the energy consumption of air conditioners accounts for about 30% of the energy in the data center. Since the energy consumption of air conditioners accounts for a large proportion of the energy in the data center, It is necessary to provide a measure to improve heat dissipation efficiency, so as to reduce energy consumption of air conditioners, thereby reducing the PUE value of the data center, and improving the energy use efficiency of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20736H05K7/1489H05K7/20145H05K7/20163H05K7/20172H05K7/20181H05K7/20336H05K7/20409H05K7/20745H05K7/20818
Inventor 曲中江池善久钟杨帆王晋
Owner HUAWEI TECH CO LTD
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