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Laser drilling method for glass

A laser drilling and laser technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as explosive points and brittle cracks

Active Publication Date: 2015-07-08
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a laser drilling method for glass to solve the problem that the existing laser drilling is prone to explosive points or brittle cracks

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  • Laser drilling method for glass

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Embodiment Construction

[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] When using the existing technology to laser drill holes in glass, since the processing trajectory generally adopts concentric circles or multiple straight line segments, the laser needs to be turned on and off frequently. When the laser is turned on or off, the laser Accumulation of pulses, sudden increase in power, or delay of pulses will cause burst points or cracks to form at the processing point or the entire glass to be brittle. And due to multiple laser switching actions, the processing time increases and the processing efficiency decreases.

[0020] An embodiment of the present inven...

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Abstract

The invention is applicable to the drilling filed of a hard and crisp material, and provides a laser drilling method for glass. The laser drilling method for the glass comprises the steps of dividing a through hole to be laser drilled into a plurality of processing layers, and processing the glass layer by layer by the laser, wherein the process path of each processing layer is an inner cycloidal path. According to the laser drilling method for the glass, the through hole to be laser drilled is divided into the plurality of processing layers, and the process path of each processing layer is the inner cycloidal path, therefore the operation of frequently turning on or off the laser can be reduced, and the blast points at the drilling place or the glass crisp caused by the sudden change of the first and last pulse delay or power of a laser device can be prevented; meanwhile, and the laser drilling efficiency can be greatly improved due to the operation of reducing turning on or off the laser.

Description

technical field [0001] The invention belongs to the field of drilling of hard and brittle materials, in particular to a laser drilling method for glass. Background technique [0002] With the development of industry and the diversity of material processing, many industries need to use hard and brittle materials, but the drilling of hard and brittle materials has become a difficult point in technology and manufacturing. Because hard and brittle materials are easily brittle in the drilling For example, the traditional machining drilling method is a hard contact method, which is very easy to crack the entire material, resulting in relatively lower yields, serious consumption of auxiliary consumables, serious pollution, and poor processing accuracy; while laser processing has become a manufacturing The mainstream processing method in the industry, but the existing laser drilling of glass also has many defects, such as too much laser power, which will cause thermal effects and ca...

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Application Information

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IPC IPC(8): B23K26/382B23K26/402B23K26/08B23K26/70
Inventor 王振华郑付成黄秋香谢建黄东海陶尚辉张峻诚乐安新高云峰
Owner HANS LASER TECH IND GRP CO LTD
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