LED device in a system-in-package
A LED device and system-level packaging technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of many process procedures, low integration, high cost, etc., to simplify the packaging process, simplify the product structure, and reduce the cost. Reduced effect
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[0031] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0032] figure 1 and figure 2 Both show a system-in-package LED device 100 , which includes a substrate 101 , a driving circuit element 102 and an LED chip 103 . The system-in-package LED device 100 also includes at least one functional module. The driving circuit element 102, the LED chip 103 and the functional modules are all fixed on the only substrate 101 by means of die bonding. Moreover, the driving circuit element 102 , the LED chip 103 and the functional modules are all electrically connected to the substrate 101 by gold wire welding, so as to realize a highly integrated system-in-package of the LED device 100 on the only substrate 101 . Compared with traditional LED packaging devices, the system-in-package LED device 100 of the present invention adds functional modules on the basis of original components, such as figure 1 104 and 105 shown in , make LED ...
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