Device for SMT process and control method of device

Abstract

The invention provides a device for the SMT process. The device comprises a first surface mount system, a second surface mount system and a reflow furnace, the first surface mount system is used for conducting SMT processing on first products, the second surface mount system is used for conducting SMT processing on second products, and the reflow furnace is used for conducting reflow processing on the first products and the second products. The device is characterized by further comprising first guide rails, second guide rails, a first sensor, a second sensor and a controller, wherein the first surface mount system is connected with the reflow furnace through the first guide rails; the second surface mount system is connected with the reflow furnace through the second guide rails; the first sensor is used for detecting the positions, on the first guide rails, of the first products; the second sensor is used for detecting the positions, on the second guide rails, of the second products; the controller is used for controlling start or shutdown of the first guide rails and the second guide rails according to detection results of the first sensor and detection results of the second sensor. Thus, the bottleneck problem of product production in the SMT procedure is solved, and product production is more intelligent.

Description

technical field [0001] The invention relates to the technical field of SMT technology, in particular to a device for SMT technology and a control method thereof. Background technique [0002] SMT (Surfacd Mounting Technology, Surface Mount Technology) is a new generation of electronic assembly technology. It compresses traditional electronic components into devices that are only a few tenths, thus realizing high-density, high-density assembly of electronic products. Reliability, miniaturization, low cost, and automation of production. [0003] In the existing technology, the SMT process has three major processes: printing, patch, and reflow. The commonly used production method is to design the equipment corresponding to the three processes into one line of production; Chip technology, resulting in a large waste of reflow furnace production capacity corresponding to the reflow process. In order to solve the above technical problems, another production method corresponding t...

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the SMT process has three major processes: printing, patch, and reflow. The commonly used production method is to design the equipment corresponding to the three processes into one line of production; chip process, resulting in a large waste of reflow furnace capacity corresponding to the reflow process

In order to solve the above technical problems, another production method corresponding to the SMT process is to connect the printing machine and the placement machine, and then manually collect the products exported by several placement machines, and then send them to a reflow furnace for production, but this There are also defects in this scheme: not only increases the manpower input, but also may cause the risk of mixing during the reflow process

Images