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Sealing process of non-sealed circular connectors in electronics industry

A technology in the electronics industry and connectors, applied in connection, assembly/disassembly of contacts, circuit/collector components, etc., can solve problems such as difficult removal, strong colloidal hardness, poor fluidity of the colloidal solution, etc., to meet high quality requirements requirements, stable performance and good maintainability

Active Publication Date: 2017-05-24
中国航发控制系统研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Now the electronic industry generally adopts epoxy resin glue for sealing treatment, and the round connector after sealing treatment is in the When the airtightness inspection is carried out under air pressure, the pass rate is only 57%, and the circular connector sealed with epoxy resin is poor in maintainability, which seriously affects product performance and production efficiency
After analysis and research, the main reasons for the above problems are: the inherent characteristics of epoxy resin glue lead to poor fluidity of the glue, which cannot fully fill the gap; and after the glue is cured, the colloid has strong adhesive force, strong colloid hardness, and is not easy to remove. When the tightness inspection fails, it is difficult to carry out rework and repair, and usually need to replace a new circular connector for sealing treatment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Sealing with tin lining: Take the ФHTMA-O-20-29S type non-sealed circular connector that needs to be sealed, seal the observation hole of the contact body that has been crimped with a soldering iron, and set the temperature of the soldering iron The temperature is 330°C, and the solder composition for tinning is Sn63Pb37;

[0027] (2) Installing the contact body: install the contact body sealed with tin lining into the sealing body of the non-sealed circular connector with a wire feeder, and fill one contact body in each hole of the sealing body;

[0028] (3) Wipe the end face: dip in 99.9% absolute ethanol with a dust-free wipe paper, and wipe the end face of the non-sealed circular connector that needs to be glued for 1 minute, and then let it stand for 8 minutes to wait for the alcohol to volatilize;

[0029] (4) The first glue injection: use a syringe to inject an appropriate amount of Lily brand HZ704 silica gel into the gap between the contact body and the sea...

Embodiment 2

[0042] (1) Sealing with tin lining: Take the ФHTMA-O-20-27S type non-sealed circular connector that needs to be sealed, seal the observation hole of the contact body that has been crimped with a soldering iron, and set the temperature of the soldering iron The temperature is 340°C, and the solder composition for tinning is Sn63Pb37;

[0043] (2) Installing the contact body: install the contact body sealed with tin lining into the sealing body of the non-sealed circular connector with a wire feeder, and fill one contact body in each hole of the sealing body;

[0044] (3) Wipe the end face: dip in 99.9% absolute ethanol with a dust-free wipe paper, and wipe the end face of the non-sealed circular connector that needs to be glued for 1 minute, and then let it stand for 10 minutes to wait for the alcohol to volatilize;

[0045] (4) The first glue injection: use a syringe to inject an appropriate amount of Lily brand HZ704 silica gel into the gap between the contact body and the se...

Embodiment 3

[0058] (1) Sealing with tin lining: Take the ФHTMA-O-22-14S type non-sealed circular connector that needs to be sealed, seal the observation hole of the contact body that has been crimped with a soldering iron, and set the temperature of the soldering iron The temperature is 350°C, and the solder composition for tinning is Sn63Pb37;

[0059] (2) Installing the contact body: install the contact body sealed with tin lining into the sealing body of the non-sealed circular connector with a wire feeder, and fill one contact body in each hole of the sealing body;

[0060] (3) Wipe the end face: dip in 99.9% absolute ethanol with a dust-free wipe paper, and wipe the end face of the non-sealed circular connector that needs to be glued for 1 minute, and then let it stand for 12 minutes to wait for the alcohol to volatilize;

[0061] (4) The first glue injection: use a syringe to inject an appropriate amount of Lily brand HZ704 silica gel into the gap between the contact body and the se...

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PUM

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Abstract

The invention relates to a sealing treatment process of a non-sealed circular connector for electronic industry. Silica gel and a unique curing process are adopted for performing sealing treatment; the non-sealed circular connector can be subjected to effective sealing treatment through steps of tin coating and blocking, contact body mounting, end surface wiping, first-time gel injection, O-shaped ring sleeving, first-time curing, forming die tool sleeving, second-time gel injection, first-time vacuum pumping, second-time curing, third-time gel injection, second-time vacuum pumping, third-time curing, forming die tool removal, sealing property inspection and the like; the treated circular connector is stable in performance, and the qualification rate of sealing property inspection reaches up to 99%; when unqualified products are discovered, the gel is easy to remove and reworking is carried out; the non-sealed circular connector is good in maintainability and meets high-quality requirements of the electronic industry.

Description

technical field [0001] The invention relates to a process for sealing a non-sealed circular connector used in the electronics industry, and belongs to the technical field of electronic product processing and manufacturing. Background technique [0002] In the current electronic industry, when the unsealed circular connector is used in an environment requiring sealing, the unsealed circular connector must be subjected to a sealing process. Now the electronic industry generally adopts epoxy resin glue for sealing treatment, and the round connector after sealing treatment is in the When the airtightness inspection is carried out under air pressure, the pass rate is only 57%, and the circular connector sealed with epoxy resin is poor in maintainability, which seriously affects product performance and production efficiency. After analysis and research, the main reasons for the above problems are: the inherent characteristics of epoxy resin glue lead to poor fluidity of the glue...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/00H01R43/20
CPCH01R43/005
Inventor 朱旺吴红王杰张立明陈旭梁张春燕盖爱飞许国福刘初
Owner 中国航发控制系统研究所
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