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OLED packaging structure and manufacturing method thereof, light emitting device

A technology of packaging structure and manufacturing method, which is applied in the fields of electrical solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of OLED observation angle dependence, achieve the effect of reducing observation angle dependence and enhancing the ability to scatter light

Active Publication Date: 2017-08-08
BOE TECH GRP CO LTD
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AI Technical Summary

Problems solved by technology

The microcavity effect will cause the electroluminescence spectrum of OLED to change with the observation angle, resulting in the observation angle dependence problem of OLED

Method used

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  • OLED packaging structure and manufacturing method thereof, light emitting device
  • OLED packaging structure and manufacturing method thereof, light emitting device
  • OLED packaging structure and manufacturing method thereof, light emitting device

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Embodiment Construction

[0044] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the OLED packaging structure provided by the present invention, its manufacturing method, and light-emitting devices will be described in detail below with reference to the accompanying drawings.

[0045] figure 1 A schematic structural diagram of an OLED packaging structure provided in Embodiment 1 of the present invention, as shown in figure 1 As shown, the OLED packaging structure may include: a base substrate 4 , an OLED 1 , a barrier layer 2 and an optical modulation layer 3 , and the barrier layer 2 and the optical modulation layer 3 are alternately formed on the OLED 1 .

[0046] In this embodiment, preferably, the barrier layer 2 and the optical modulation layer 3 may be alternately formed on the OLED 1 according to the number of alternating periods, and the optical modulation layer 3 is located on the barrier layer 2 in each alternating period. Th...

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Abstract

The invention discloses an OLED encapsulation structure, a manufacturing method thereof, and a light emitting device. The OLED encapsulation structure includes: a base substrate, an OLED, a barrier layer and an optical modulation layer, the OLED is formed on the base substrate, and the barrier layer and the optical modulation layer are alternately formed on the OLED. In the technical scheme of the OLED encapsulation structure and its manufacturing method provided by the present invention, the barrier layer and the optical modulation layer are formed alternately on the OLED, and the optical modulation layer enhances the light-scattering ability of the OLED and changes the propagation direction of part of the light, thereby reducing the The observation angle dependence of OLED due to the microcavity effect is explained.

Description

technical field [0001] The invention relates to the field of manufacturing organic electroluminescent displays, in particular to an OLED encapsulation structure, a manufacturing method thereof, and a light emitting device. Background technique [0002] Organic Light-Emitting Diode (hereinafter referred to as: OLED) is called the first because of its advantages such as active light emission, good temperature characteristics, low power consumption, fast response, bendable, ultra-thin and low cost. Three generations of fantasy display technology. At present, driven by the continuous capital investment and technology research and development of global manufacturers, OLED flat panel display technology is tending to the stage of increasingly mature mass production technology and rapid growth of market demand. [0003] OLED can be divided into three types according to the light output direction, namely: bottom-emitting OLED, top-emitting OLED and double-sided emitting OLED. Botto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8445H10K50/85H10K50/854
Inventor 朱儒晖于军胜
Owner BOE TECH GRP CO LTD
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