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Preparation method of led white light diode

A technology of diodes and LED chips, which is applied in the field of preparation of LED white light diodes, can solve the problems of reduced light output rate of phosphor powder, low production efficiency, high cost of equipment and molds, etc., and achieve rapid mass production, low cost of production input, and high-quality products The effect of quality assurance

Active Publication Date: 2017-06-13
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
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Problems solved by technology

The encapsulation method of the above-mentioned air pressure screw dispensing method requires extremely high investment in equipment and mold costs; while the syringe dispensing method has uneven mixing of the phosphor powder and epoxy resin, and the phosphor powder will precipitate in the epoxy resin Reduced light extraction rate, and the amount of epoxy resin poured and many other problems will cause unstable product quality, and because the production process of the two methods is easily limited by a single variety, it is difficult to package this method. Converted to mass production mode, the production efficiency is also low

Method used

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  • Preparation method of led white light diode
  • Preparation method of led white light diode

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Embodiment Construction

[0017] The present invention will be further described below with the given examples, but not limited thereto.

[0018] like figure 1 , 2 Shown, a kind of preparation method of LED white light diode, described LED white light diode comprises first lead 1, second lead 2, blue LED chip 3 and epoxy resin adhesive layer 4 containing yellow fluorescent powder, and described first The lead 1 has a first patch base island 1-1 and a first pin 1-2 integrated with each other, and the second lead 2 has a second patch base island 2-1 and a second pin 2- 2. The blue LED chip 3 is mounted on the first SMD base island 1-1 and electrically connected to the first SMD base island 1-1, and the surface of the blue LED chip 3 is connected to the second SMD base island. The island 2-1 is electrically connected, and the first patch base island 1-1, the second patch base island 2-1 and the blue LED chip 3 are covered with an epoxy resin glue layer 4 containing yellow phosphor powder Inside; and it...

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Abstract

The invention discloses a preparation method of an LED white light diode. The LED white light diode comprises first and second leads, a blue LED chip and an epoxy resin adhesive layer containing yellow fluorescent powder; each of the first and second leads is provided with integrated first and second mounting islands and integrated first and second pins; the blue LED chip is mounted on the first mounting island and electrically connected with the first mounting island; the surface of the blue LED chip is electrically connected with the second mounting island; the first mounting island, the second mounting island and the blue LED chip are covered with the epoxy resin adhesive layer containing the yellow fluorescent powder; the preparation method of the LED white light diode comprises the step a of preparing the epoxy resin adhesive layer cake containing the yellow fluorescent powder, the step b of die bonding, the step c of bonding, the step d of injection molding and solidifying, and the step e of forming, thereby obtaining the LED white light diode. The preparation method is reasonable, high in production efficiency and low in investment cost.

Description

technical field [0001] The invention relates to a preparation method of an LED white light diode, belonging to the technical field of semiconductor packaging. Background technique [0002] At present, the lead frame of the existing white light diode has a cup-shaped cover made of EMC / PPA plastic, and the transparent glue containing phosphor is applied to the cover by air pressure screw dispensing method or syringe dispensing method. Injection, so that the periphery of the light-emitting chip forms a hemispherical lens layer, and the light-emitting chip reflects light through the cup-shaped cover. The encapsulation method of the above-mentioned air pressure screw dispensing method requires extremely high investment in equipment and mold costs; while the syringe dispensing method has uneven mixing of the phosphor powder and epoxy resin, and the phosphor powder will precipitate in the epoxy resin Reduced light extraction rate, and the amount of epoxy resin poured will cause un...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/50
CPCH01L33/50H01L33/501H01L33/62H01L2933/0041
Inventor 贾东庆
Owner CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
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