Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

ATE (automatic test equipment)-based MCU (microprogrammed control unit)/SOC (system on chip) test method

A test method and chip technology, applied in the detection of faulty computer hardware, functional inspection, etc., can solve the problems of poor ATE receiving information, difficult to achieve, etc., to increase the amount of test data, reduce the test cost, and reduce the test time. Effect

Active Publication Date: 2015-04-29
CHIPSEA TECH SHENZHEN CO LTD
View PDF8 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to use ATE to replace all other external devices on hardware, because ATE has poor ability to receive information, and free communication between ATE and MCU / SOC is currently difficult to achieve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • ATE (automatic test equipment)-based MCU (microprogrammed control unit)/SOC (system on chip) test method
  • ATE (automatic test equipment)-based MCU (microprogrammed control unit)/SOC (system on chip) test method
  • ATE (automatic test equipment)-based MCU (microprogrammed control unit)/SOC (system on chip) test method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0040] Please refer to figure 1 As shown, it is the ATE / DUT communication connection diagram realized by the present invention. DUT (Device under test device under test) is also MCU / SOC chip. Since there are various models of MCU / SOC chip, it is collectively called DUT.

[0041] ATE adopts 4-wire communication for each DUT, and the 4-wire communication includes CLK, Data, Cmd, Read). CLK is controlled by ATE, and Data is controlled by ATE and DUT at the same time. One side controls and one side releases; Cmd and Read are the synchronization signals of ATE and DUT respectively. When Cmd generates a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an ATE (automatic test equipment)-based MCU (microprogrammed control unit) / SOC (system on chip) test method. The method is characterized in that the ATE is taken as a basic platform, and the reliable communication of the ATE and other devices is realized through a self-defined communication protocol. After a test is started, the ATE sends an instruction 1 and an incentive 1 to a device to be tested through a protocol, test data 1 is automatically recorded, an instruction 2 and an incentive 2 are sent to the device to be tested, test data 2 is automatically recorded, and the process is carried out until all item tests are finished. According to the method, the ATE and the MCU / SOC can keep free communication to accurately and reliably connect with external equipment, all manual operations are omitted, test data quantities are increased, and meanwhile, chip test time is greatly shortened.

Description

technical field [0001] The invention belongs to the technical field of chip testing, in particular to a testing method for MCU / SOC chips. Background technique [0002] Unlike other ICs, MCU / SOC chips have no fixed input and output, and their functions depend on the code programmed by the user. At the same time, MCU / SOC chips often have a large number of components (memory, ADC / DAC, timer, PWM, interrupt control, LDO, serial port, etc.). This determines that the MCU / SOC chip is a collection of "including various chips". When in use, the user can program the chip to flexibly control one of its components (such as ADC) to achieve the desired effect. Therefore, the testing of this type of chip means that it is necessary to verify the "memory chip", "verify the ADC chip", "verify the DAC chip", and verify the "LDO chip" through different programming configurations. In the research and development stage, the most commonly used test method is: build a simple board-level circuit ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F11/26
Inventor 宋恩琳
Owner CHIPSEA TECH SHENZHEN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com