Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Analysis method for spreading effect of requirement change

A technology of requirement change and analysis method, applied in the field of software development, can solve problems such as improper management decision-making of requirement change, difficulty in estimating the workload of requirement change, etc.

Active Publication Date: 2015-03-25
CHANGSHU INSTITUTE OF TECHNOLOGY
View PDF4 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a demand change ripple effect analysis method, which solves the problems of difficult estimation of demand change workload and improper demand change management decision-making due to failure to effectively define the demand change ripple effect in the process of demand change management

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Analysis method for spreading effect of requirement change
  • Analysis method for spreading effect of requirement change
  • Analysis method for spreading effect of requirement change

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to enable the public to fully understand the technical essence and implementation effects of the present invention, the applicant will describe in detail the specific implementation of the present invention below in conjunction with the accompanying drawings, but the applicant's description of the embodiments is not a limitation to the technical solution. Changes in the form of the inventive concept rather than in substance should be regarded as the protection scope of the present invention.

[0037] see figure 1 , the present invention relates to a demand change ripple effect analysis method, comprising the following steps:

[0038] S1) Extract requirement dependencies in the process of software problem analysis, and use requirement dependency graphs to model requirement dependencies;

[0039] S2) Use a requirement traceability matrix to describe the traceability relationship between user requirements, real world domains, and machine specifications in softwar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an analysis method for the spreading effect of a requirement change, and belongs to the technical field of software development. The analysis method comprises the steps that requirement dependencies are extracted in the software problem analysis process and modeled according to a requirement dependency diagram; the tracing relation among a real world field in a problem space, user requirements and software products in a machine specification-solution space is described through a tracing matrix; software requirement products affected by the requirement change are recognized through horizontal requirement change spreading effect analysis based on the requirement dependency diagram, and software design products and code products affected by the requirement change are recognized through vertical requirement change spreading effect analysis based on the tracing matrix; the software requirement products, the design products and the code products affected by the requirement change are collected to form a soft product set affected by the requirement change. The analysis method has the advantage that the problem that because the spreading effect of the requirement change is not effectively defined, the requirement change workload is difficult to estimate and requirement change management decisions are improper.

Description

technical field [0001] The invention belongs to the technical field of software development, and in particular relates to a demand change ripple effect analysis method, which is suitable for software demand change management. Background technique [0002] During the software life cycle, software requirements often change. There are many reasons for changes in software requirements, including omissions or errors in software requirements caused by insufficient requirements engineering, changes in business objectives, changes in the software use environment, new requirements raised by users or customers, etc. For most software projects, changes in requirements are inevitable and unpredictable. In order to protect the existing software and hardware investment market and gain a better competitive advantage, software companies must quickly respond to demand changes, define the ripple effects of demand changes, identify software products that need to be modified due to demand chan...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/44
Inventor 董瑞志
Owner CHANGSHU INSTITUTE OF TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com