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Adhesion device for transparent packaging film

A technology of bonding device and transparent packaging, applied in packaging, transportation packaging, transportation and packaging, etc., can solve problems such as affecting the appearance quality of product outsourcing packaging film, and large contrast of packaging overlapping surface film.

Active Publication Date: 2015-03-25
CHINA TOBACCO YUNNAN IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing mechanical equipment for wrapping the transparent film out of the product packaging box is all bonded by heating, so that when the product packaging box is repeatedly opened and closed by a heated soldering iron, it acts on the joint of the transparent film to be bonded for a certain period of time. The thermal bonding of the lap of the transparent film can be completed; when the area of ​​the lap of the transparent film to be bonded is large or the number of laps at both ends is large, it is often because there is a small amount of air or moisture between the transparent films and the built-in packaging box The surface is uneven, the surface of the soldering iron is not fully bonded to the surface to be packaged, or the electrostatic adsorption between the films is not fully in place before thermal bonding, so that the film to be bonded can complete the entire product even though it is lapped. The film of the packaging is formed, but it cannot be very reliably bonded to the entire lap surface at the same time or remove the air between the film laps, so that the opacity that is contrasted with the non-lapping transparent film on the packaging lap surface film is formed, Thus affecting the appearance quality of the product outsourcing packaging film

Method used

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  • Adhesion device for transparent packaging film
  • Adhesion device for transparent packaging film
  • Adhesion device for transparent packaging film

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Embodiment Construction

[0050]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] figure 1 Shown is a three-dimensional view during processing of a bonding device for a transparent packaging film, and the bonding device includes a frame 2 and a conveyor belt 4;

[0052] The conveyor belt 4 is arranged on the frame 2;

[0053] Both sides of the conveyor belt 4 are provided with retaining strips 21, 22, which are used for the protection of the folded laps of the packaging film at both ends of the packaging box 1 and the guiding and pos...

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Abstract

The invention discloses an adhesion device for a transparent packaging film. An adhesion interface of the packaging film is smooth, the adhesion intensity is reliable and transparency is good. The adhesion device comprises a rack and a conveyor belt arranged on the rack. Barrier strips are arranged on the two sides of the conveyor belt and used for protecting packaging film folding lapping openings in the two ends of a packaging case and guiding and positioning the packaging case. The two sides of the conveyor belt are each vertically provided with first rotary iron, and the first rotary iron is used for adhesion of the packaging film folding lapping openings in the two ends of packaging case. Second rotary iron is horizontally arranged above the conveyor belt and used for adhesion of a long edge lapping opening of the packaging film of the packaging case. The first rotary iron and the second rotary iron are both driven by a motor. Local air left between two layers of films to be bonded as well as between multiple layers of films at the folding position when existing planar iron and a transparent film adhere integrally can be effectively eliminated, and the problem that adhesion of the film lapping opening is not firm and transparency is not high when air cannot be exhausted is solved.

Description

technical field [0001] The invention relates to the technical field of transparent film bonding equipment for packaging boxes, in particular to a bonding device for transparent packaging films. Background technique [0002] The existing mechanical equipment for wrapping the transparent film out of the product packaging box is all bonded by heating, so that when the product packaging box is repeatedly opened and closed by a heated soldering iron, it acts on the joint of the transparent film to be bonded for a certain period of time. The thermal bonding of the lap of the transparent film can be completed; when the area of ​​the lap of the transparent film to be bonded is large or the number of laps at both ends is large, it is often because there is a small amount of air or moisture between the transparent films and the built-in packaging box The surface is uneven, the surface of the soldering iron is not fully bonded to the surface to be packaged, or the electrostatic adsorpt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B51/16
CPCB65B51/16
Inventor 吴俊冯洪涛黄云杰
Owner CHINA TOBACCO YUNNAN IND
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