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Analysis method of temperature resistance of circuit board

An analysis method and technology of temperature resistance, which is applied in the field of temperature resistance analysis of circuit boards, can solve problems such as performance degradation and failure of PCIE boards, and achieve the effect of reducing the cost of test equipment

Active Publication Date: 2017-05-17
BEIJING JINGDONG SHANGKE INFORMATION TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the temperature reaches a certain value, the performance of the PCIE board will decrease or fail

Method used

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  • Analysis method of temperature resistance of circuit board
  • Analysis method of temperature resistance of circuit board
  • Analysis method of temperature resistance of circuit board

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Embodiment Construction

[0014]

[0015] The innovation of the present invention lies in the support of heat transfer theory. Based on Fourier's heat conduction law and Newton's law of cold removal, the heat is conducted from the main control chip of the PCIE board to the surface of the radiator, and then convective heat exchange with the cold air flow. The heat is finally The process of being carried away by the cooling air flow. After research by the inventor, it is found that the thermal conductivity λ value of the same PCIE board is basically unchanged under different ambient temperatures.

[0016] Such as figure 1 As shown, the PCIE board includes a package body 1 , a core 2 of a main control chip packaged by the package body 1 , a thermally conductive material 3 located on the surface of the package body 1 , and a heat sink 4 attached to the thermally conductive material 3 . figure 1 The arrows in the figure show the heat conduction process, the heat is conducted from the core 2 at the core t...

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Abstract

The invention relates to a circuit board card temperature tolerance analysis method. The method is used for testing the maximum heat-resistance temperature of a circuit board card at room temperature. The method comprises the following steps: a temperature difference measurement process, measuring the environment temperature of the card and the core temperature of a main control chip after the circuit board card is stable in temperature at a condition that preset air volume and air pressure of cooling air flow are kept in a working condition, and calculating the difference of the core temperature of the main control chip and the environment temperature of the card; a core temperature increment process; a maximum core temperature measurement process, measuring the core temperature of the main control chip as the maximum core temperature of the main control chip when the circuit board card is nearly ineffective or reduced in performance; and a maximum heat-resistance temperature calculation process, calculating the maximum heat-resistance temperature of the circuit board card based on the measured maximum core temperature of the main control chip and the temperature difference.

Description

technical field [0001] The invention relates to a method for analyzing the temperature resistance of a circuit board, in particular to a method for testing the maximum heat-resistant temperature of a PCIE board under room temperature conditions. Background technique [0002] PCIE (Peripheral Component Interconnect Express) is the latest bus and interface standard. There are many types of PCIE boards. Generally, PCIE boards in servers mainly include SSD (Solid State Drive) cards and external cards. Different types of cards have different functions. There is no uniform standard for the position of these boards in the server. Some are arranged in the front of the server motherboard and are given priority for cooling; some are distributed in the back of the server motherboard and are cooled by the hot air from the CPU radiator. This causes the PCIE boards to be at different card ambient temperatures. If the temperature of the card environment where the PCIE boards are located ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
Inventor 毛士飞高丰王中平
Owner BEIJING JINGDONG SHANGKE INFORMATION TECH CO LTD
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