Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An open microfluidic chip and its manufacturing method and control method

A technology of a microfluidic chip and a manufacturing method, applied in the field of microfluidics, can solve the problems of high manufacturing cost, difficult operation, difficult large area, patterned ultra-smooth surface preparation, etc., so as to reduce preparation difficulty and cost, and reduce viscosity. The hysteresis resistance, the method is simple and effective

Active Publication Date: 2017-08-15
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the published patents and articles, it is only mentioned as a smooth, non-staining, self-healing surface, and there is no mention of microfluidic manipulation of fluids or droplets for movement, nor does it mention detailed SLIPS Preparation Process
[0007] The existing SLIPS preparation process is relatively complicated, and the operation is difficult. It is difficult to prepare a large-area, patterned super-slip surface, and it is difficult to achieve complex manipulation of fluids or droplets.
In addition, the production cost is correspondingly higher

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An open microfluidic chip and its manufacturing method and control method
  • An open microfluidic chip and its manufacturing method and control method
  • An open microfluidic chip and its manufacturing method and control method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] In this example, an adhesive layer is first formed by coating a viscous substance, and then a microsphere template is formed by a splashing method, and then the microsphere template is patterned and cut, and then the patterned template is softly copied and transferred using PDMS to obtain a concave microsphere. Finally, lubricating oil is filled into the concave microstructure to obtain a super-smooth surface, and a planar microfluidic chip is made.

[0070] The method for making the super-slippery surface in this embodiment specifically includes the following steps:

[0071] (a) Apply a layer of glue evenly on the substrate, and the thickness of the glue should be uniform to avoid uneven surface of the formed adhesive layer.

[0072] (b) in accordance with figure 2 In the manner shown, a large number of PS microspheres are evenly sprinkled on the surface of the adhesive layer of the substrate in step (a), the substrate is tilted and the unadhered microspheres are rem...

Embodiment 2

[0078] The difference between this embodiment and Embodiment 1 is that this embodiment forms an adhesive layer by pasting double-sided adhesive tape on the substrate, and other steps are the same as Embodiment 1.

Embodiment 3

[0080] The difference between this embodiment and Embodiment 1 is that this embodiment uses a printer to print viscous substances (glue) on the substrate to form a patterned adhesive layer; Form a single-layer microsphere template; then use PDMS to perform soft replication on the single-layer microsphere template; finally, fill the lubricating oil in the concave microstructure formed by soft replication to form a lubricating oil film, obtain a super-smooth surface, and make a planar microfluidic device. chip.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an open microfluidic chip, a manufacturing method and a control method thereof. The open microfluidic chip of the present invention includes a chip substrate, on which a super-slip surface is formed, wherein the super-slip surface is a liquid covering layer formed by filling the surface with concave microstructures with lubricating oil. The open microfluidic chip of the present invention adopts a super-smooth surface, which greatly reduces the viscous resistance of exogenous substances moving on its surface, thereby expanding the driving mode of exogenous substances, especially fluids, increasing the flexibility of manipulation, and can Sensitive systems are manipulated.

Description

technical field [0001] The invention relates to the field of microfluidic technology, in particular to an open microfluidic chip and its manufacturing method and control method. Background technique [0002] At present, the mainstream and relatively mature microfluidic chips are all channel-type microfluidic chips. Due to the large viscous resistance between the fluid and the tube wall, especially in micro- or nano-scale microchannels, according to the relationship between the viscous resistance and the radius in the circular tube, the diameter of the circular tube is reduced by an order of magnitude, and the viscous resistance is at least increased by more than 4 orders of magnitude. Therefore, commonly used microfluidic chips require relatively large and complex external drive devices to provide driving force. The larger driving force also leads to higher pressure in the microchannel. Therefore, the sealing requirements for the bonding of the microfluidic chip, various e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B01L3/00
Inventor 吴天准凌世全
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products