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MEMS Structure Reconstruction and Detection Method Based on CT Scanning Image

A technology of CT scanning and detection methods, which is applied in the field of three-dimensional reconstruction and detection of MEMS structures, can solve the problems of high detection environment requirements and inability to respond to three-dimensional shapes, etc., and achieve the effect of solving high detection environment requirements and ensuring non-destructive testing

Active Publication Date: 2017-02-15
CHINA UNIV OF PETROLEUM (EAST CHINA)
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Problems solved by technology

[0005] The present invention proposes a method for three-dimensional reconstruction and detection of MEMS structures based on CT scanning images to solve the problem that the existing detection means have high requirements for the detection environment and cannot reflect its three-dimensional shape, and at the same time ensure the non-destructive detection of MEMS

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  • MEMS Structure Reconstruction and Detection Method Based on CT Scanning Image

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Embodiment Construction

[0017] The present invention takes VC++6.0 as the development platform, and the program runs on the Windows XP / Windows7 32-bit or 64-bit operating system platform. Hardware environment, memory: 2G or above; hard disk: 80G or above; video card: 500M or above; monitor: resolution 1024X768 or above. After scanning the MEMS components, the tomographic image is obtained, and after image processing, it is read into the program for model reconstruction, and the image display and interaction are realized through OpenGL. After calculation by the internal algorithm, the program writes out the grid-optimized data file, tetrahedron subdivision data file, block model data file and model feature data, and finally exports the Abacus file and Solid works file through the data interface to Model structural analysis and model mechanical analysis are carried out. The specific steps and operations are as follows:

[0018] Step 1: Acquiring a tomographic image of the micromechanical structure of...

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Abstract

The invention discloses an MEMS structure three-dimensional reconstruction and detection method based on CT scanned images. The MEMS structure three-dimensional reconstruction and detection method based on the CT scanned images aims to solve the problems that an existing detection means has high requirements for detection environment and can not reflect three-dimensional shapes of MEMS structures, and meanwhile guarantees nondestructive testing of an MEMS. According to the method, firstly, serial images of an MEMS device are obtained in a scanning mode by adopting the industrial CT technology; secondly, the images are processed and volume data of the images are obtained, surface modal reconstruction is carried out according to the volume data and a surface triangular mesh model of the MEMS device is obtained; then, the surface model is repaired, feature information of the surface model is recognized and extracted, and different features of the device model are classified into different feature blocks; finally, fitting is carried out on the classified feature blocks, feature parameters are extracted and data interface files are educed. Through the technical means, accurate detection of the three-dimensional structure of the MEMS structure is achieved.

Description

technical field [0001] The invention relates to reconstruction and detection of MEMS structures, in particular to a method for three-dimensional reconstruction and detection of MEMS structures based on CT scanning images. Background technique [0002] MEMS is the abbreviation of Micro-Electro-Mechanical System, and its full name is Micro-Electro-Mechanical System. MEMS is a high-tech that has developed rapidly in recent years, involving multiple disciplines, and its product outlines are below the millimeter level and above the nanometer level. Due to the ultra-small size of MEMS products, they have many optical and electrical characteristics that conventional mechanical products do not have, which makes MEMS technology have very broad application prospects in many fields. [0003] While the ultra-small structure of MEMS products has outstanding advantages, it also brings great difficulty to the processing quality inspection of MEMS products. At present, MEMS processing and...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T17/00G06T17/30
Inventor 牛文杰王晓斌白永涛吕长荣孙政
Owner CHINA UNIV OF PETROLEUM (EAST CHINA)
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