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A method for improving production efficiency and equipment utilization rate of smt patches

A technology of production efficiency and utilization rate, applied in data processing applications, assembly of printed circuits with electrical components, comprehensive factory control, etc., can solve problems such as idle waste of new equipment, difficulties in spare parts, and reduced production line efficiency, so as to improve production efficiency , Reduce equipment idle rate, improve production efficiency and equipment utilization effect

Active Publication Date: 2017-03-22
江苏诸葛智能系统有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

This is because it takes a long time for SMT engineers to learn and get familiar with new brands of equipment, and it is difficult to configure spare parts for multiple brands of equipment
If a new brand of equipment is deployed into the production line, before the engineers and producers are as familiar with the new brand of equipment as the old brand equipment, the operational problems of the new brand equipment will seriously reduce the efficiency of the production line; if the new brand equipment is not deployed in time Into the production line, it will cause idle waste of new equipment

Method used

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  • A method for improving production efficiency and equipment utilization rate of smt patches

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Embodiment Construction

[0034] Attached below figure 1 The present invention is described further:

[0035] A method for improving SMT patch production efficiency and equipment utilization rate,

[0036] The first step is to arrange and classify all the equipment in the workshop in a row and group:

[0037] Column "team": A certain process in the workshop, such as the placement process, has 12 placement machines. As an example, these 12 placement machines are arranged into 7 "teams" (team 1 to team 7). Among the teams, some teams consist of a single device; some teams consist of multiple devices. The 7 teams are arranged in parallel.

[0038] Group "group": the 7 teams in this process form a group (group 1); all existing and available equipment in the same process are also arranged in parallel on the position of the team to form a group (group 2, group 3,...).

[0039] In the second step, during SMT production, the production line configuration is performed in real time according to the equipmen...

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Abstract

The invention relates to the technical field of electronic SMT machines, in particular to a method for improving the SMT production efficiency and the SMT device utilization rate. The method includes the step that after all devices are ranked, grouped and arranged to form blocks, orders of two or more types of products can be arranged at the same time for on-line production. As configurations of a production line are combined in a customized mode in real time according to production of each type of products to be produced, the production efficiency is improved, and the device vacancy rate is lowered; as the production line is not arranged in series any more, working procedure devices which do not need to be used can be directly skipped during configuration combining; newly-added devices can be added into the blocks in real time; when problems which can not be easily solved in a short time occur on certain devices, the whole production line does not need to be stopped for overhauling, the devices can be cancelled from the blocks in real time for repairing, reserved devices are rapidly added into the blocks, influences, caused by device faults, on production are reduced to the maximum degree, and the production efficiency and the device use rate are improved.

Description

technical field [0001] The invention relates to the technical field of electronic placement machines, in particular to a method for improving SMT placement production efficiency and equipment utilization rate. Background technique [0002] SMT chip production refers to the process of applying solder paste on the pad of the PCB bare board, then placing the SMD chip electronic components on the PCB bare board and reflow soldering. It is a key basic manufacturing link in the electronic information industry. , is a capital-intensive and technology-intensive field. The amount of funds required to build an SMT production line ranges from several million yuan to tens of millions of yuan. In order to improve the efficiency of SMT equipment production, the SMT industry has been exploring in terms of technology and management for many years. The time of each cycle in the placement process needs to be accurately calculated to within one tenth of a second. [0003] At present, the SMT...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418G06Q10/06H05K3/30
CPCY02P90/02
Inventor 张志
Owner 江苏诸葛智能系统有限公司
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