Fingerprint identification sensor packaging structure and method
A fingerprint identification and packaging structure technology, which is applied in character and pattern recognition, instruments, electric solid devices, etc., can solve the problem of low recognition accuracy of capacitive fingerprint recognition sensors and ineffective capacitive sensing effects of capacitive fingerprint recognition sensors, etc. problem, to achieve the effect of improving recognition accuracy, increasing recognition distance, and sensing
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[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0032] figure 1 It is a schematic cross-sectional view of the packaging structure of the fingerprint recognition sensor of the present invention Figure 1 . The fingerprint recognition sensor provided in this embodiment can specifically be a capacitive fingerprint recognition sensor, and can be used in electronic devices, such as smart phones, t...
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