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Electromagnetic induction plate structure and manufacturing method thereof, and electromagnetic handwriting input device

A technology of electromagnetic induction and production method, which is applied in the input/output process of data processing, electrical digital data processing, instruments, etc., can solve the problems such as the inability to meet the thinning of products and the inability to effectively reduce the overall thickness of the digital board, so as to reduce the overall The effect of thickness

Active Publication Date: 2017-11-07
WACOM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the multi-layer substrate used in the induction antenna loop structure in the known digital board has a certain limit on the number of layers (thickness limit), so that the overall thickness of the known digital board cannot be effectively reduced, and cannot meet the requirements of thinning products

Method used

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  • Electromagnetic induction plate structure and manufacturing method thereof, and electromagnetic handwriting input device
  • Electromagnetic induction plate structure and manufacturing method thereof, and electromagnetic handwriting input device
  • Electromagnetic induction plate structure and manufacturing method thereof, and electromagnetic handwriting input device

Examples

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no. 1 example 〕

[0053] see figure 1 ,and Figure 2A to Figure 2C As shown, the first embodiment of the present invention provides a manufacturing method of the electromagnetic induction plate structure M (or antenna plate structure), which may include the following steps: first, as figure 1 As shown, a multilayer substrate 1 is provided, wherein two opposite outermost surfaces of the multilayer substrate 1 respectively have a first outermost conductive layer 12A and a second outermost conductive layer 12B (S100); then, Cooperate Figure 2B and Figure 2C As shown, a first insulating layer 2 is formed on the first outermost conductive layer 12A of the multilayer substrate 1 by coating, printing or any other forming method (as shown by the solid arrow) (S102), so that The first insulating layer 2 may directly contact the first outermost conductive layer 12A of the multilayer substrate 1; then, cooperate Figure 2B and Figure 2CAs shown, a second insulating layer 3 is sequentially formed o...

no. 2 example

[0060] see figure 1 ,and Figure 3A to Figure 3C As shown, the second embodiment of the present invention provides a method for manufacturing an electromagnetic induction panel structure M, which may include the following steps: first, as figure 1 As shown, a multilayer substrate 1 is provided, wherein two opposite outermost surfaces of the multilayer substrate 1 respectively have a first outermost conductive layer 12A and a second outermost conductive layer 12B (S200); then, Cooperate Figure 3B and Figure 3C As shown, a first insulating layer 2 is attached (as shown by a hollow arrow) on the first outermost conductive layer 12A of the multilayer substrate 1 through a first adhesive layer 6 (S202), so that the first adhesive Layer 6 is disposed between the first insulating layer 2 and the first outermost conductive layer 12A of the multilayer substrate 1; Figure 3B and Figure 3C As shown, a second insulating layer 3 is sequentially formed on the second outermost condu...

no. 3 example

[0063] see figure 1 ,and Figure 4A to Figure 4C As shown, the third embodiment of the present invention provides a method for manufacturing an electromagnetic induction plate structure M, which may include the following steps: first, as figure 1 As shown, a multilayer substrate 1 is provided, wherein two opposite outermost surfaces of the multilayer substrate 1 respectively have a first outermost conductive layer 12A and a second outermost conductive layer 12B (S300); then, Cooperate Figure 4B and Figure 4C As shown, a first insulating layer 2 is formed on the first outermost conductive layer 12A of the multilayer substrate 1 by coating, printing or any other forming method (as shown by the solid arrow) (S302), so that The first insulating layer 2 may directly contact the first outermost conductive layer 12A of the multilayer substrate 1; then, cooperate Figure 4B and Figure 4C As shown, a prefabricated three-layer structure formed by sequentially stacking a second a...

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Abstract

An electromagnetic induction panel structure includes a multilayer substrate, a first cover unit and a second cover unit. The multilayer substrate includes a first outermost lateral conductive layer and a second outermost lateral conductive layer respectively disposed on two opposite outermost surfaces thereof. The first cover unit is disposed on the first outermost lateral conductive layer. The second cover unit is disposed on the second outermost lateral conductive layer. For example, the first cover unit includes a first insulating layer directly formed on the first outermost lateral conductive layer for directly contacting the first outermost lateral conductive layer. The second cover unit includes a second insulating layer directly formed on the second outermost lateral conductive layer for directly contacting the second outermost lateral conductive layer. The second cover unit includes a wave-absorbing material layer directly formed on the second insulating layer for directly contacting the second insulating layer.

Description

technical field [0001] The invention relates to an electromagnetic induction board structure and its manufacturing method, and an electromagnetic handwriting input device, especially to an electromagnetic induction board structure and its manufacturing method which can reduce the overall thickness to meet the requirements of thinning products, and an electromagnetic handwriting input device. device. Background technique [0002] A product combination of a digital tablet or tablet usually includes an electromagnetic pen and a digital tablet. The electromagnetic pen generally uses a circuit composed of capacitance and inductance. When the user uses the electromagnetic pen to write on the digital board, the change of the contact force of the electromagnetic pen on the digital board will change the inductance and the transmission frequency, so that the The pressure exerted by the pen tip of the electromagnetic pen on the digital board is displayed on the display device in the f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/046
CPCG06F3/03545G06F3/046G06F2203/04103Y10T29/4902
Inventor 李文杰叶嘉瑞许上仁
Owner WACOM CO LTD
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