Detection method and device for PCBA board

Abstract

The invention discloses a detection method and device for a PCBA board of an infrared tube touch frame. When detection is conducted according to the method, the short circuit condition and the open circuit condition of internal modules of the PCBA board can be detected firstly, and when some internal modules of the PCBA board are not connected in the static state and signals can not be continuously transmitted, closed circuits can be formed by triggering the internal modules which are not connected in the static state in the to-be-detected PCBA board through the detection device, and therefore the aims of short circuit detection and open circuit detection are achieved. According to the method, short circuits or closed circuits between insertion pins inside the to-be-detected PCBA board can be detected, for example, some closed circuits, should not be formed, formed when tin connection appears in the product machining process, and therefore functions of the PCBA board can not be influenced.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a detection method and detection device for a PCBA board with an infrared tube touch frame. Background technique [0002] In the production of the existing infrared tube touch frame PCBA, packaging technology is generally used to package the infrared tube touch frame PCBA. However, as the integration of the infrared tube touch frame PCBA becomes higher, it becomes more and more difficult to detect its quality. [0003] The current detection method relies on manual visual inspection, or does not inspect, and detects during functional testing during back-end assembly. This detection method is inefficient and prone to missed inspections, and defective products are mixed into finished products, which has an impact on product quality. For the PCBA address line, if there is a short circuit or an open circuit, the defect cannot be detected through the subsequent functional inspection, whi...

AI Technical Summary

Problems solved by technology

However, as the integration of infrared tube touch frame PCBA becomes higher, it becomes more and more difficult to detect its quality.

[0003] The current detection method relies on manual visual inspection, or does not inspect it, and detects it during functional testing during back-end assembly. This detection method is inefficient and prone to missed inspections, and defective products are mixed into finished products, which has an impact on product quality.

For the PCBA address line, if there is a short circuit or an open circuit, the defect cannot be detected through the subsequent functional inspection, which will affect the effect of the product, but it is impossible to have a very fine test effect during production testing, so it is missed. high probability

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