Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of LED encapsulation structure and preparation method thereof

A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high production cost, inability to achieve consistency, leakage, etc., and achieve good luminous consistency, good appearance consistency, and production. cost reduction effect

Active Publication Date: 2017-07-28
LIGHTKING TECH GRP CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of LED packaging structure is prone to fatal hidden dangers such as electric leakage and dead lights.
In addition, the dispensing plane in the cavity of the bowl and cup will have "concave cup" and "convex cup" defects due to the amount of glue, and the product's luminous angle and brightness will be affected, making it impossible to achieve consistency
Moreover, when this kind of LED packaging structure is prepared, it is formed by dispensing and curing, so that the structure and shape of the product are relatively fixed and single, and it cannot be flexibly applied to various application situations.
Moreover, when preparing LED packaging structures in the prior art, if you want to prepare LED packaging structures of various sizes, you can only prepare brackets of various sizes, and the development cost of the brackets is particularly high, resulting in the production of LED packaging structures of various sizes. high production cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of LED encapsulation structure and preparation method thereof
  • A kind of LED encapsulation structure and preparation method thereof
  • A kind of LED encapsulation structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 2

[0038] The difference between this specific embodiment and the first embodiment is that the metal pins of the prepared LED bracket are in a bent state, and correspondingly, the clamping state of the mold is different during the preparation process.

[0039] In the preparation method of the LED packaging structure of this specific embodiment, the preparation process is the same as that of the specific embodiment 1, except that the metal pins of the LED bracket prepared in step 1) are in a bent state, and accordingly the LED bracket in step 4) is in the mold The specific state in the cavity is slightly different, and the processing in step 6) is slightly different. Only this difference will be described in detail below.

[0040] In this specific embodiment, when performing step 4), such as Figure 11 shown. Put the solid and welded LED bracket into the inner cavity of the heat-insulating molding mold. When the LED bracket is loaded, the metal pin 21 is in a bent state, and the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED packaging structure and a manufacturing method thereof. The manufacturing method comprises the steps of (1) preparing an LED support which comprises a shell and metal pins connected to the shell, wherein a bowl-shaped inner cavity is formed in the shell; (2) fixing LED chips to the bottom of the bowl-shaped inner cavity; (3) binding the LED chips; (4) installing the LED support in an inner cavity of a heating and heat preserving die, and pressing the die to achieve sealing; (5) injecting epoxy molding compounds into the die through a glue injection hole of the die to enable the inside and outside of the bowl-shaped inner cavity of the shell to be filled with the epoxy molding compounds, and solidifying the epoxy molding compounds; (6) opening the die, taking out the LED support, processing the metal pins of the LED support to enable the metal pins to make contact with the epoxy molding compounds outside the shell, and obtaining the LED packaging structure. By the adoption of the LED packaging structure and the manufacturing method thereof, LED packaging structures with multiple shapes, structures and sizes can be produced conveniently and flexibly, electric leakage and lighting failures of the LED packaging structure obtained are avoided, and product consistency is high.

Description

[0001] 【Technical field】 [0002] The invention relates to light emitting diodes, in particular to an LED packaging structure and a preparation method thereof. [0003] 【Background technique】 [0004] The existing LED packaging structure is mainly SMD LED (SMD-LED). The packaging method of the SMD LED has a bracket potting type. The bracket potting type LED packaging structure includes a bracket, such as figure 1 As shown, it is a schematic structural diagram of the bracket, and the bracket includes a shell 100 and copper pins 200 . The shell 100 is made of PPA plastic, and is provided with a cavity of a plastic bowl, in which an LED chip is mounted by crystal bonding, and the LED package structure is obtained after curing with liquid epoxy resin. This kind of LED packaging structure is prone to fatal hidden dangers such as electric leakage and dead lights. In addition, the dispensing plane in the cavity of the bowl and cup will have "concave cup" and "convex cup" defects d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/52H01L33/00
CPCH01L33/52H01L33/56H01L33/62H01L2933/005H01L2933/0066
Inventor 邹启兵罗新房
Owner LIGHTKING TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com