Large diameter nail head lead wire filling equipment

Abstract

The invention provides large-diameter nail head lead filling equipment comprising a nail head lead sorting board, blocking pieces and nail head lead filling strips. The nail head lead sorting board comprises a board body, the board body is provided with N parallel nail head lead slides at equal intervals, convex ridges are formed on the two sides of each nail head lead slide, each nail head lead slide comprises a groove in the middle and bearing portions on the two sides of the groove, the board body inclines, the lower end of each nail head lead slide is provided with a round discharging hole penetrating through the board body in the thickness direction, the blocking pieces are used for blocking the round discharging holes, the nail head lead filling strips are provided with N notches at equal intervals, the notches are used for containing nail head leads falling off from the round discharging holes and enabling the nail head leads to be suspended on the nail head lead filling strips, the interval between the nail head lead slides and the line spacing or the column spacing of the nail head lead hole positions on a sintering graphite plate are the same, and N is greater than or equal to 3. The nail head leads can be sorted automatically, filling of the N nail head leads can be achieved at a time, and the production efficiency is high.

Description

technical field [0001] The invention relates to a coaxial plastic-encapsulated diode, in particular to a large-diameter nail head lead wire filling device. Background technique [0002] Among the many electronic devices currently used in electronic products, coaxial plastic-encapsulated diodes have many advantages in terms of structure and electrical properties, and are widely used in various electronic circuits. Among them, coaxial diodes with a diameter of 5.5 mm in the nail head are widely used in many electronic devices such as low-voltage rectifiers, solar cells, and liquid crystal displays because of their high power and good heat dissipation effects. Businesses are working hard to expand production scale, adapt to market demand, and improve economic efficiency. [0003] At present, in the production process of coaxial plastic-encapsulated diodes, nail-head leads with a diameter of more than 5.5mm cannot be filled by machines on a large scale. They need to be manually...

AI Technical Summary

Problems solved by technology

[0003] At present, in the production process of coaxial plastic-encapsulated diodes, the nail-head leads with a diameter of more than 5.5mm cannot be filled by machines on a large scale, and one by one is required manually. Install it into a graphite disk, and a graphite disk has 300 holes, that is, it needs to manually fill 300 nail-head leads, which is very inefficient, and because the operator's hands are inevitably stained with dust and salt, it is easy to contaminate the nails connected to the chip. The end face of the head, resulting in the electrical decline of the diode after plastic molding, affecting the yield, and there are some potential quality problems

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