Method for testing failure of airplane antiskid brake control box under condition of temperature cycle

Abstract

The invention provides a method for testing failure of an airplane antiskid brake control box under the condition of temperature cycle. According to the method, the antiskid brake working current is applied in the temperature cycle test process of the airplane antiskid brake control box. The high temperature value in the temperature cycle process is determined according to the high temperature working limit of the antiskid brake control box, the low temperature value in the temperature cycle process is determined according to the low temperature working limit of the antiskid brake control box, and the determined temperature cycle profile is suitable for testing the manufacturing defect that the antiskid brake control box is sensitive to steady change and can stimulate hidden dangers of the antiskid brake control box in the working state so as to effectively verify whether the development defect of the antiskid brake control box exists or not and provides the improvement suggestions according to the test result.

Description

technical field [0001] The invention relates to the field of electrical products of an aircraft landing gear control system, in particular to a method for testing the failure of an aircraft anti-skid brake control box during a temperature cycle. Background technique [0002] The method of initiating failure of electronic products under temperature cycling conditions is an experimental technique in the development process. [0003] The anti-skid brake control box is an electronic product in the aircraft landing gear control system. It is designed to control the brake function of the take-off line, the anti-skid function during the landing brake process, the grounding protection function during landing, and the wheel of the left and right landing gear wheels during the landing process. There are multiple functions such as space protection, and any function that does not meet the design requirements is a failure. When the components in the anti-skid brake control box break dow...

AI Technical Summary

Problems solved by technology

Although this method has an obvious effect on screening defects such as welding of electronic products, some solder joints still break during use, or other failures occur, and the screening of defects is not thorough;

[0009] 2) According to the rapid temperature cycle method in GMW8287 "Highly Accelerated Life / Highly Accelerated Stress Screening and Sampling Inspection" written by General Motors Corporation of the United States, the heating and cooling rate is 45 ° C ~ 60 ° C / min, and the power is turned on during the test. Although it has a significant effect on screening welding defects of electronic products, because the influence of working current on welding and other defects is ignored, the excitation effect of welding and other defects under the conditions of temperature cycle and working current is not very ideal;

[0024] Therefore, the existing temperature cycle test technology has incomplete screening of faults

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