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Array substrate, manufacturing method thereof and displaying device

An array substrate and substrate substrate technology, applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve the problem of large touch blind area, improve touch performance, eliminate touch blind area, and simplify the number of film layers. Effect

Active Publication Date: 2014-09-03
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Embodiments of the present invention provide an array substrate, a manufacturing method thereof, and a display device, so as to solve the problem in the prior art that the touch blind area in the self-capacitance touch structure is too large

Method used

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  • Array substrate, manufacturing method thereof and displaying device
  • Array substrate, manufacturing method thereof and displaying device
  • Array substrate, manufacturing method thereof and displaying device

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Embodiment 1

[0125] In Embodiment 1 of the present invention, the production such as figure 2 The method shown for arraying substrates is described in detail.

[0126] Preferably, the manufacturing method of the array substrate in the embodiment of the present invention includes:

[0127] Step 1, such as figure 2 As shown, a gate 11 and a gate line 12 are formed on the base substrate 00;

[0128] Wherein, through a Gate Mask (gate etching) process, an electrically connected gate and a gate line are formed on the base substrate.

[0129] Among them, in the prior art, through a Gate Mask process, a gate Vcom line is also formed on the base substrate, which is arranged on the same layer as the gate and the gate line and is electrically insulated;

[0130] However, in the embodiment of the present invention, the gate Vcom line may or may not be fabricated.

[0131] Step 2, such as figure 2 As shown, a gate insulating layer 90 is formed on the film layer where the gate 11 and the gate l...

Embodiment 2

[0152] In Embodiment 2 of the present invention, a method for manufacturing a color filter substrate disposed opposite to an array substrate will be described in detail.

[0153] Preferably, the manufacturing method of the color filter substrate of the embodiment of the present invention includes:

[0154] Step 1, forming a black matrix layer on the base substrate;

[0155] Wherein, a black matrix layer is formed on the base substrate through a BM Mask (black matrix layer etching) process.

[0156] Step 2, forming an RGB (red, green and blue) color film layer on the black matrix layer;

[0157] Wherein, by R Mask (red sub-pixel unit etching) process, G Mask (green sub-pixel unit etching) process, and Mask (blue sub-pixel unit etching) process, the RGB is formed on the black matrix layer. Color film layer.

[0158] Step 3, forming a planarization layer on the RGB color filter layer;

[0159] Step 4, forming PS on the planarization layer.

[0160] Wherein, the PS is formed ...

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Abstract

The invention relates to the technical field of touching, in particular to an array substrate, a manufacturing method thereof and a displaying device. The problem that in the prior art, a touch blind zone in a self-capacitance touching structure is too large is solved. The array substrate comprises a grid electrode, a grid line and an active layer. The grid electrode and the grid line are arranged on a substrate base plate. The active layer is arranged on a film layer where the grid electrode and the grid line are placed. The array substrate further comprises a pixel electrode which is arranged on the same layer as the active layer and is electrically insulated from the active layer, a drain electrode, a source electrode, a data line, a common electrode layer and a plurality of lead wires. The drain electrode, the source electrode and the data line are arranged on the film layer where the active layer and the pixel electrode are placed. The drain electrode and the pixel electrode are electrically connected directly. The common electrode layer is placed on the film layer where the drain electrode, the source electrode and the data line are placed, and the common electrode layer is electrically insulated from the drain electrode, the source electrode, the data line and the pixel electrode. The lead wires and the common electrode are arranged on different layers. The common electrode layer comprises a plurality of self-capacitance electrodes which are arranged on the same layer and are insulated from each other. Each lead wire is electrically connected with the corresponding self-capacitance electrode through a via hole.

Description

technical field [0001] The present invention relates to the field of touch technology, in particular to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] With the rapid development of display technology, touch screen panels (Touch Screen Panels) have gradually spread in people's lives. At present, the touch structures included in the touch screen can be divided into: a mutual capacitance touch structure and a self-capacitance touch structure. As for the self-capacitance touch structure, due to its high accuracy of touch sensing and relatively high signal-to-noise ratio, it is favored by major panel manufacturers. [0003] At present, the self-capacitance touch structure uses the principle of self-capacitance to detect the touch position of the finger. Specifically, a plurality of self-capacitance electrodes set on the same layer and independent of each other are set in the touch structure. When the human body does not to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77G02F1/1362G02F1/1368
CPCG02F1/13338G06F3/04166G06F3/0443G06F3/03545
Inventor 杨盛际董学王海生薛海林刘英明赵卫杰刘红娟丁小梁王磊王春雷
Owner BOE TECH GRP CO LTD
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