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Molding apparatus

A molding device and molding material technology, which is applied in the field of pre-melted polyamide molding devices and insert molding, can solve the problems of unusable potting, a large amount of waste, long curing time, etc., and achieve low operating costs, reduced production cycle, large The effect of machine throughput

Inactive Publication Date: 2014-08-20
THE CAVIST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy-based methods require long curing times (24 hours) and generate large amounts of waste
Unused epoxy will cure making it unusable for potting
Because epoxies are usually hard and brittle, they are also unsuitable for some applications
Also, epoxy can be somewhat toxic and expensive

Method used

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Embodiment Construction

[0054] In the following detailed description of the preferred embodiments, a portion of this application is described with reference to the accompanying drawings. The drawings show by way of example specific embodiments for practicing the invention. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.

[0055] The present invention relates to apparatus and methods for forming. The methods and apparatus disclosed herein can be applied in many industries and applications, such as automotive manufacturing, wiring harness industry, sensor manufacturing and white goods industry. Examples of articles that can be molded using the method and apparatus of the present invention include, but are not limited to: encapsulation and exterior protection of electronic devices; printed circuit board encapsulation; strain relief molding on connectors, cables and wires; molding of insulating ga...

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Abstract

A method and apparatus for low pressure molding are disclosed. The molding apparatus comprises a frame, a mold assembly and a transmission assembly. The mold assembly may comprise a first mold and a second mold, the second mold being coupled to the frame. The transmission assembly may be coupled to the frame and to the first mold. A motor may be coupled to the transmission assembly for moving the first mold relative to the second mold. A pneumatic actuator may also be coupled to the transmission assembly for increasing clamping pressure between the first mold and the second mold.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Patent Application Serial No. 61 / 534,838, filed September 14, 2011, and U.S. Provisional Patent Application Serial No. 61 / 540 / 989, filed September 20, above The content of each application is incorporated herein by reference. technical field [0003] The present invention relates to devices for low pressure forming and methods of use thereof. The invention also relates to a pre-melted polyamide molding device, which is mainly used for insert molding. More specifically, it is directed to a molding device using a hot-melt adhesive such as a dimer acid type polyamide resin. This raw material can be used to mold at relatively low pressure, allowing fragile components to be encapsulated. Background technique [0004] Although insert molding machines using hot melt adhesives are well known, these machines are often retrofitted from hot melt application equipment. An ex...

Claims

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Application Information

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IPC IPC(8): B29C33/22B29C45/68
CPCB29C45/68B29C33/22B29C45/045B29C45/0441
Inventor K·卡尔森R·汉森W·蒂洛
Owner THE CAVIST CORP
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