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Resin composition, resin composition sheet, semiconductor device and method for manufacturing same

A resin composition and sheet technology, which can be used in the manufacture of semiconductor/solid-state devices, semiconductor devices, and electric solid-state devices, etc., can solve problems such as the reduction of device reliability, and achieve high connection reliability, low melt viscosity, and good resistance. Effect

Inactive Publication Date: 2014-07-30
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, there is a problem that the cured product of the resin composition expands and contracts greatly due to temperature changes, thereby generating stress inside the semiconductor device and reducing the reliability of the device.

Method used

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  • Resin composition, resin composition sheet, semiconductor device and method for manufacturing same
  • Resin composition, resin composition sheet, semiconductor device and method for manufacturing same
  • Resin composition, resin composition sheet, semiconductor device and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] Components (a) to (f) were mixed so as to have the composition ratio shown in Table 1, and a treatment was performed for 3 hours using a ball mill to uniformly mix the materials to prepare a paste resin composition. Zirconia balls "YTZ balls" (trade name, manufactured by Nikkato Corporation) having a diameter of 5 mm were used in the ball mill. After the ball mill treatment, the zirconia balls were removed with a sieve to obtain a paste resin composition.

[0137] (1) Evaluation of storage stability of paste resin composition (storage stable period (within 10% change in viscosity))

[0138] The storage stability of the paste resin composition was evaluated by measuring the temporal change of the viscosity. First, the viscosity of the prepared resin composition was measured, and the viscosity when the resin composition was stored at room temperature was measured every several days. Compared with the initial viscosity, the number of storage days when the viscosity incre...

Embodiment 2～31、 comparative example 1～4

[0158] Preparation and evaluation of the resin composition were carried out in the same manner as in Example 1 except that the components (a) to (f) were mixed so as to have the composition ratios shown in Tables 1 to 7. The results are shown in Tables 1-7.

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Abstract

Provided is a resin composition which has both a high storage stability and a high interface reliability, said resin composition comprising: (a) an epoxy compound; (b) a microcapsule type hardening accelerator; and (c) inorganic particles surface-modified with a compound having an unsaturated double bond.

Description

technical field [0001] The present invention relates to a resin composition that can be used for bonding electronic components used in personal computers, portable terminals, etc., substrates such as heat sinks and printed circuit boards and flexible substrates, bonding electronic components, and bonding substrates, etc. . More specifically, the present invention relates to a method for bonding semiconductor chips such as ICs and LSIs to circuit substrates such as flexible substrates, glass epoxy boards, glass substrates, ceramic substrates, and silicon interposers. , Resin compositions used in lamination of semiconductor chips such as bonding semiconductor chips, three-dimensional mounting, etc. It also relates to a resin composition that can be used for an insulating layer, an etching resist, a solder resist, and the like used in the production of circuit boards such as build-up multilayer boards. Background technique [0002] In recent years, as semiconductor devices ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C09J7/00C09J9/02C09J11/04C09J163/00H01L21/60C09J7/10
CPCC08L63/00H01L24/83H01L2224/2929H01L2224/29298H01L2224/83203C08K3/36C08K9/04C08K9/10C09J2203/326C09J2463/00C08G59/24H01L24/81H01L2224/29386H01L2224/81815H01L2924/15787H01L2924/15788H01L2224/81203H01L2224/81907H01L2224/83907C08G59/188C08L33/08C08L79/08C09J7/10H01L2224/83862H01L24/29C09J2301/304C09J2301/408H01L2924/05442H01L2924/00C09J163/00H01L2224/2919
Inventor 榛叶阳一藤丸浩一野中敏央
Owner TORAY IND INC
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