A kind of manufacturing method of led filament

A technology of LED filament and manufacturing method, which is applied in the direction of electrical components, electric solid devices, circuits, etc., which can solve the problems of uneven light output, high cost, and low benefit, and achieve the effects of uniform light color, low cost, and small equipment investment

Active Publication Date: 2016-09-28
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, most companies use molding equipment. Although they can package filaments with uniform light color, the output is low, the cost is high, and the benefit is low. Some companies can produce small batches by dispensing glue on the substrate, but due to The side is not covered with fluorescent glue, the light output is not uniform enough, and there is chromatic aberration

Method used

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  • A kind of manufacturing method of led filament
  • A kind of manufacturing method of led filament
  • A kind of manufacturing method of led filament

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for manufacturing an LED filament in this embodiment specifically includes the following steps:

[0034] 1) if figure 1 As shown, print pads on the entire base, and pre-split each base 1, and use a laser cutting machine to cut the base to ensure that each base 1 has a half-cut state;

[0035] Wherein, the base 1 can be made of glass, ceramic or metal material, in this embodiment, the base is preferably glass;

[0036] Wherein, the base 1 is a columnar body with a rectangular parallelepiped structure, and the ratio between the length and width is 15-40. Preferably, the width range is 0.8-1.2 mm, the length range is 20-40 mm, and the height range is 0.2-0.8 mm. ;

[0037] Wherein, the base 1 has at least one LED chip mounting surface, in this embodiment, the base has one LED chip mounting surface 11;

[0038] 2) LED chips are placed on the chip mounting surface of the base, and there are multiple LED chips on each base, and these LED chips are connected in ser...

Embodiment 2

[0050] The main difference between the LED filament manufacturing method provided in this embodiment and the LED filament manufacturing method provided in Embodiment 1 is:

[0051] The base provided by Embodiment 1 has an LED chip mounting surface, and the base of this embodiment is as Figure 4 As shown, there are two LED chip mounting surfaces, respectively the first LED chip mounting surface 11 and the second LED chip mounting surface 12, the first LED chip mounting surface 11 is arranged along the horizontal direction, and the second LED chip mounting surface 12 is parallel to The first LED chip mounting surface 11, in other embodiments, the second LED chip mounting surface 12 can also intersect with the first LED chip mounting surface 11, each LED chip mounting surface is provided with a The bent electrode 2 electrically connected to the disk, the structure of the bent electrode 2 is the same as that of the bent electrode in the first embodiment, and will not be repeated ...

Embodiment 3

[0053] The main difference between the LED filament manufacturing method provided in this embodiment and the LED filament manufacturing method provided in Embodiment 1 is:

[0054] The base provided in Embodiment 1 has an LED chip mounting surface, and the base 1 of this embodiment is as Figure 5 , 6 As shown, there are four LED chip mounting surfaces, which are respectively the first LED chip mounting surface 11, the second LED chip mounting surface 12, the third LED chip mounting surface 13 and the fourth LED chip mounting surface 14. The first LED chip mounting surface The surface 11 is arranged along the horizontal direction, the second LED chip 12 mounting surface is parallel to the first LED chip mounting surface, the third LED chip mounting surface 13 and the fourth LED chip mounting surface 14 are respectively located on both sides of the first LED chip mounting surface, Each chip mounting surface is provided with a bent electrode 2 that is electrically connected to ...

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PUM

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Abstract

The invention discloses a manufacturing method of an LED lamp filament. The manufacturing method of the LED lamp filament comprises the following steps that (1) a whole base blank body is prepared, wherein each base of the whole base blank body is provided with at least one LED chip installation surface; (2) a plurality of LED chips are arranged on each LED chip installation surface; (3) the whole base blank body is divided into single bases, and each LED chip installation surface is provided with an electrode; (4) a carrying plate with pits is prepared, the bases are put into the pits, one end of each electrode extends out of the corresponding pit, fluorescent adhesives are applied for formation, the periphery of each base is wrapped with the fluorescent adhesives, and the LED chips are covered by the fluorescent adhesives. According to the LED lamp filament manufactured through the method, due to the fact that all the surfaces of each base are wrapped with the fluorescent adhesives, the bases can be made of glass or ceramics or metal, omni-angle light emitting with even light color can be achieved without adding a lens or a reflection cover, the light loss caused when the lens is added and the light effect is affected is avoided, and compared with a lamp filament manufactured through a molding model, the LED lamp filament is smaller in equipment input, is lower in cost and saves processes.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a method for manufacturing an LED filament. Background technique [0002] At present, there are many LED filament light sources on the market. In the past, to achieve a certain illuminance and illumination area for LED light sources, it was necessary to install optical devices such as lenses, which would affect the lighting effect and reduce the energy-saving effect of LEDs. [0003] At present, although there are many types of LED filaments, it is mainly to place dies, seed wires, and encapsulate fluorescent glue on glass or metal substrates. So far, most companies use molding equipment. Although they can package filaments with uniform light color, the output is low, the cost is high, and the benefit is low. Some companies can produce small batches by dispensing glue on the substrate, but due to The side is not covered with fluorescent glue, the light output is not uniform enough, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54
Inventor 夏勋力麦家儿唐永成
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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