Resin molded product and molding method and molding apparatus thereof

Abstract

The present invention relates a resin molded product and a molding method and molding apparatus thereof, which are capable of preventing the reduction of the appearance quality caused by wire fusing. The molding apparatus comprises a chamber (2C) which includes a plurality of molding parts (21 to 23), front ends of which are connected through a connection part (20); a pouring opening (24), which injects resin to the chamber (2C); resin stopping parts (25A, 25B), which are configured on a connection position of a molding parts (22, 23) and a connection part (20), and retain the resin flowing in the connection part (20). The resin stopping parts are respectively provided with a sliding block (27) and a compressing spiral spring (28), which release the retained resign the resign flowing in the molding parts (22, 23).

Description

technical field [0001] The present invention relates to a resin molded product molded by injection molding using a mold, and in particular, to a resin molded product partially including a plurality of connected linear parts, a molding method thereof, and a molding device. Background technique [0002] In recent automotive lamps, in addition to the existing marking function, a designed photoconductor (light guide) is arranged inside the lamp in order to improve the appearance of the lamp. As one of such photoconductors, a photoconductor having a design in which a plurality of linear photoconductors are connected to each other at ends has been proposed. For example, in figure 1 In the illustrated lamp 100 , a grid-shaped or comb-shaped photoconductor 1 is arranged in a lamp housing 110 . 11, 12, 13 are formed by connecting at the connecting portion 10, and a light source 101 such as an LED is arranged opposite to the base end surfaces of the base end portions 11a, 12a, 13a o...

AI Technical Summary

Problems solved by technology

[0006] In the case of applying the technique of Patent Document 1 to resin molding of a photoconductor and disposing a convex portion on a part of the cavity, the flow of the resin is always delayed at the convex portion and the flow of the resin is disturbed. , there is a problem that voids (bubbles) etc. are generated at this portion to deteriorate the filling property of the resin or to reduce the molding quality

On the other hand, in the case where the movable block is arranged on a part of the chamber as described in Patent Document 1, such a problem does not arise, but a mechanism for moving the movable block is required so that the molding device The structure is complex, resulting in high cost of the mold, and it is difficult to control the timing of moving the movable block, making the molding work troublesome

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