Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible non-adhesive copper clad laminate and preparation method thereof

A copper clad laminate and flexible technology, applied in the field of flexible non-adhesive copper clad laminate and its preparation, can solve the problems of poor heat resistance, consistent expansion coefficient of copper foil, and high bonding strength, and achieve dimensional stability and bonding strength. Satisfying effect

Active Publication Date: 2016-04-20
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The three-layer adhesive type flexible copper clad laminate is composed of copper foil, adhesive and polyimide film. Due to the adhesive, its heat resistance is poor
The current polyimide cannot simultaneously solve the two problems of consistent expansion coefficient with copper foil and high bonding strength

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible non-adhesive copper clad laminate and preparation method thereof
  • Flexible non-adhesive copper clad laminate and preparation method thereof
  • Flexible non-adhesive copper clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0023] The embodiment of the present invention discloses a method for preparing a flexible adhesive-free copper-clad laminate, which includes the following steps:

[0024] (A) The aromatic dianhydride with the structure of formula (I), the nitrogen-containing aromatic heterocyclic diamine with the structure of formula (II) and the aromatic diamine with the structure of formula (III) are polymerized in an organic solvent to obtain polyamide acid solution;

[0025]

[0026] Among them, R 1 for

[0027] R 2 for

[0028] R 3 for

[0029] (B) Coating the polyamic acid solution on a copper foil, removing the organic solvent and performing thermal imidization to obtain a flexible adhesive-free copper clad laminate.

[0030] In the present invention, aromatic dianhydrides and diamines with specific structures are selected, and polyimide resins are obtained through polymerization and imidization. The present invention selects aromatic dianhydrides with the structu...

Embodiment 1

[0038] 2,5-bis(4-aminophenyl)pyridine (1.568g, 0.006mol) and 4,4'-diaminodiphenyl ether (0.801g, 0.004mol) were added to N-methylpyrrolidone (20g) , stirred at room temperature to dissolve the solid. Add 4,4′-biphenyldianhydride (2.942 g, 0.010 mol) and stir at room temperature for 24 hours to form a polyamic acid solution.

[0039] After the polyamic acid solution was salivated and coated on the surface of the copper foil, it was dried in a vacuum oven at 110° C. for 240 minutes. Then, it was slowly heated to 300° C. in a nitrogen-protected oven and kept for 60 minutes. That is, a flexible non-adhesive copper clad laminate is obtained.

Embodiment 2

[0041]2,5-bis(4-aminophenyl)pyrimidine (1.574g, 0.006mol) and 4,4'-diaminodiphenyl ether (0.801g, 0.004mol) were added to N-methylpyrrolidone (20g) , stirred at room temperature to dissolve the solid. Add 4,4′-biphenyldianhydride (2.942 g, 0.010 mol) and stir at room temperature for 24 hours to form a polyamic acid solution.

[0042] After the polyamic acid solution was salivated and coated on the surface of the copper foil, it was dried in a vacuum oven at 110° C. for 240 minutes. Then, it was slowly heated to 300° C. in a nitrogen-protected oven and kept for 60 minutes. That is, a flexible non-adhesive copper clad laminate is obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention provides polyimide resin. The polyimide resin is prepared according to the following method that a polymerization reaction is performed on aromatic dianhydride of the structure as a structural formula (I), nitrogenous heteroaromatic diamine of the structure as a structural formula (II) and aromatic diamine of the structure as a structural formula (III) in an organic solution to obtain a polyamide acid solution; copper foil is coated with the polyamide acid solution, and hot imidization is performed after the organic solution is removed to obtain a flexible glue-free copper-clad plate. The polyimide resin is matched with the copper foil in thermal expansion coefficient, and size stability of the copper-clad plate in the application process is achieved. Moreover, bonding strength between the polyimide resin and the copper foil is good.

Description

technical field [0001] The invention relates to the field of polymer resins, in particular to a flexible non-adhesive copper-clad laminate and a preparation method thereof. Background technique [0002] Polyimide is a class of materials with high strength, high modulus, high heat resistance and high dielectric properties, and has been widely used in aerospace, membrane separation, and microelectronics manufacturing fields. In the field of microelectronics, polyimide is often used as an insulating base film for flexible printed circuits. [0003] Flexible printed circuits are usually divided into two types of flexible copper clad laminates: three-layer adhesive type and double-layer non-adhesive type. The three-layer adhesive type flexible copper clad laminate is composed of copper foil, adhesive and polyimide film. Due to the adhesive, its heat resistance is poor. When the temperature is higher than 150°C, as the adhesive deteriorates, the peel strength of the three-layer ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05D7/24B05D3/00C08G73/10B32B15/08
Inventor 郭海泉姚海波杜志军康传清金日哲丁金英邱雪鹏高连勋
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com