COB binding line test method

Abstract

The invention discloses a COB binding line test method. The test method comprises the steps that a circuit board which determines that COB binding lines are normal is placed on a fixture; a through short circuit test instrument is used to measure the impedance between the binding lines on the circuit board which determines that the COB binding lines are normal, and the error range of the impedance between the binding lines is set and saved; a circuit board to be tested is placed on the fixture, and the circuit board to be tested and the circuit board which determines that the COB binding lines are normal share the same circuit design; the through short circuit test instrument is used to measure the impedance between the binding lines on the circuit board to be tested, and the impedance is respectively compared with the saved error range of the impedance between the binding lines; and whether a binding line fault alarm is given is determined according to a comparison result. According to the invention, by measuring the impedance between all COB binding lines on the circuit board, a COB binding line test is completed; and the method has the advantages of low test cost and simple test result.

Description

technical field [0001] The invention relates to the field of COB testing, in particular to a COB bonding wire testing method. Background technique [0002] COB, or Chip On Board, is a chip packaging technology commonly used in the electronics field. The process of COB is first to use thermally conductive epoxy resin on the surface of the substrate, generally epoxy resin doped with silver particles, to cover the placement point of the silicon chip, and then place the silicon chip directly on the surface of the substrate, heat treatment until the silicon chip is firmly fixed on the substrate So far, the method of wire bonding is used to directly establish an electrical connection between the silicon chip and the substrate, that is, the semiconductor chip is hand-attached and mounted on the printed circuit board, and the electrical connection between the chip and the substrate is realized by wire stitching and covered with resin to ensure reliability. In addition to COB techn...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the technical problem of inaccurate test results and high cost caused by many human factors in the existing COB bonding wire testing method, the present invention provides a new COB bonding wire testing method, which uses a short-circuit tester to measure the line The impedance between all bonding wires on the board is used to complete the test of COB bonding wires. This test method is simple, reliable, and low in cost. Testers only need to check the output of the test results.

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