Adhesive film for encapsulating electronic element
A technology of electronic components and adhesive films, applied in the field of adhesive films for packaging electronic components, can solve problems such as equipment hazards, limited effects, damage, etc., and achieve the effects of stable properties, not easy to fall off, and reduced chemical or physical damage
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Embodiment 1
[0011] An adhesive film for encapsulating electronic components, wherein: the adhesive film is composed of the following components in parts by mass: 35 parts of silicone resin, 15 parts of acrylic resin, 12 parts of bentonite, 4 parts of titanium oxide, 3 parts of polyethylene wax and functional auxiliary 5 parts of agent, wherein the functional aids include 2 parts of aluminum silicate fiber, 2 parts of aliphatic amine curing agent and 1 part of film-forming aid.
Embodiment 2
[0013] An adhesive film for encapsulating electronic components, wherein: the adhesive film is composed of the following components in parts by mass: 55 parts of silicone resin, 25 parts of acrylic resin, 18 parts of bentonite, 9 parts of titanium oxide, 7 parts of polyethylene wax and functional auxiliary 9 parts of agent, wherein the functional aids include 4 parts of aluminum silicate fiber, 3 parts of aliphatic amine curing agent and 2 parts of film-forming aid.
Embodiment 3
[0015] An adhesive film for encapsulating electronic components, wherein: the adhesive film is composed of the following components in parts by mass: 45 parts of silicone resin, 18 parts of acrylic resin, 16 parts of bentonite, 6 parts of titanium oxide, 6 parts of polyethylene wax and functional auxiliary 7 parts of agent, wherein the functional auxiliary agent includes 3 parts of aluminum silicate fiber, 3 parts of aliphatic amine curing agent and 1 part of film-forming aid.
[0016] The excellent effects achieved by the present invention will be further illustrated through specific experiments below.
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