Device for producing baked products

A baking and product technology, which is applied in the field of crisp wafers or soft wafers, and can solve the problems of unusable baked products, damage to mechanical parts, and waste products in the oven.

Active Publication Date: 2014-03-05
HAAS FOOD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, due to contamination - for example due to adhering baking residues - multiple injections (Mehraufguss) can occur on the baking tray, whereby not only the baked product becomes unusable, but also mechanical parts of the baking tray and tongs ...

Method used

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  • Device for producing baked products
  • Device for producing baked products
  • Device for producing baked products

Examples

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Embodiment Construction

[0027] Figure 1 to 3 The bakeware according to the present invention is shown, and its structure in principle corresponds to the prior art. The illustrated embodiment shows the upper bakeware 1 and the lower bakeware 2, wherein this is a self-supporting bakeware, which does not require a support frame. In the closed state shown, the two baking trays are close to each other on the baking surfaces to such an extent that only the required gap 4 for the dough to be baked remains between the baking surfaces. The baking surface can be provided with grooves in a known manner, as is known from flat wafers or soft wafers. Groove in Figure 1 to 3 Not shown in.

[0028] As in figure 2 As shown in cross section in the upper bakeware has a sensor device 5 in the form of a separate sensor 6. The sensor 6 is arranged in the sensor receiving opening 7 in the bakeware, wherein, in this embodiment, the sensor with its sensor head 8 extends until close to the baking surface 3 of the bakeware 1...

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PUM

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Abstract

The invention relates to a device for producing baked products, in particular edible crisp waffles or soft waffles, comprising at least one baking plate (1, 2), the baking surface of which can be heated to a baking temperature. Said device is characterized in that the baking plate has a sensor device (5) for detecting the temperature of the baking plate (1, 2) and/or the pressure acting on the baking surface (3) of the baking plate (1, 2) during the baking process.

Description

Technical field [0001] The present invention relates to a device for making baked products, especially for making edible crisp wafers or soft wafers, wherein at least one bakeware is provided that preferably moves through the baking chamber during baking, The baking surface can be heated at baking temperature. Background technique [0002] This device is especially a wafer oven. Wafer ovens with circulating baking tongs (Backzange) have been known for a long time to industrially produce any type of wafers. In addition, it has been known so far to measure and adjust the furnace temperature to achieve a good baking process. However, the current temperature measurement has always been performed only indirectly by an infrared heat sensor (Infrarotw?rme sensor, which is arranged in the oven cavity and measures the temperature at the back side of the bakeware, for example). The disadvantage here is the great inertia of the system, and the temperature measurement does not give inform...

Claims

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Application Information

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IPC IPC(8): A21B1/42
CPCA21B3/00A21B1/42H04Q9/00A21B5/023A21B1/46
Inventor J.哈亚斯S.杰拉斯彻克M.科普夫
Owner HAAS FOOD EQUIP
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