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Image module and mobile terminal containing the image module

A technology of imaging modules and passive components, which is applied in the field of imaging module design, can solve the problems of dust easily falling into the photosensitive chip, easy to fall off, and welding is not very firm, so as to improve the imaging effect, improve the yield rate, and prevent loosening Effect

Inactive Publication Date: 2016-08-10
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the image module of a traditional mobile terminal is assembled, passive components (such as capacitors or resistor components, etc.), photosensitive chips and PCB boards are all assembled in a closed cavity, especially the passive components and photosensitive chips are located in the same space. area, so that during the testing or transportation of the image module, the dust between the passive components and the PCB will easily fall on the photosensitive chip, thereby affecting the imaging effect of the image module
In addition, when passive components are soldered, affected by the soldering method, material, or dirt, the soldering is not very firm, and it is easy to fall off during drop testing or transportation, which affects product yield.

Method used

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  • Image module and mobile terminal containing the image module
  • Image module and mobile terminal containing the image module
  • Image module and mobile terminal containing the image module

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Embodiment Construction

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as...

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Abstract

The invention relates to an image module, which includes a circuit board, a photosensitive chip, a passive element, a light filter, a bracket and a seal. The bracket forms an accommodating cavity with the circuit board and the optical filter. The photosensitive chip, the passive element and the seal are located in the accommodating cavity. The seal encloses the passive element. The passive components of the image module are wrapped in seals, which can reinforce the passive components and prevent loosening of passive components during drop tests or transportation, and improve the yield of products; in addition, because the seals wrap the entire passive components, the passive components The dust between the circuit board and the circuit board will not escape and fall on the photosensitive chip under vibration, and the imaging effect of the image module will not be affected, which further improves the imaging effect of the entire image module. In addition, the invention also relates to a mobile terminal containing the image module.

Description

technical field [0001] The invention relates to the field of imaging module design, in particular to an image module and a mobile terminal containing the image module. Background technique [0002] Existing mobile terminals, especially some handheld mobile terminals, have higher and higher requirements for imaging. The video module of the mobile terminal has always been a hot spot in the design of the industry. When the image module of a traditional mobile terminal is assembled, passive components (such as capacitors or resistor components, etc.), photosensitive chips and PCB boards are all assembled in a closed cavity, especially the passive components and photosensitive chips are located in the same space. Therefore, during the testing or transportation of the image module, the dust between the passive components and the PCB will easily fall on the photosensitive chip, thereby affecting the imaging effect of the image module. In addition, when passive components are sold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03B17/12G02B7/02
Inventor 齐书
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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