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Appearance check device and appearance check method

An appearance inspection device and appearance inspection technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve problems such as unrealistic, unclear judgment, and not necessarily guaranteed inspection quality, so as to ensure inspection quality, ensure inspection accuracy, Effects of preventing storage errors

Inactive Publication Date: 2013-10-30
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the calibration work of the inspection function requires man-hours such as installing a prepared calibration jig for each measurement item and photographing it, in normal production activities, delicate work is performed frequently Correction jobs become unrealistic
Therefore, the inspection accuracy of the visual inspection device may not always be guaranteed, and if an inspection error is found in a subsequent process to judge a non-conforming product as a good product, it is necessary to investigate the cause and trace it back to which process, which is unclear. actual situation of judgment
In this way, in the prior art, it is difficult to always ensure the inspection accuracy of the visual inspection device, and there is a problem that the inspection quality cannot be guaranteed.

Method used

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  • Appearance check device and appearance check method
  • Appearance check device and appearance check method

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Embodiment Construction

[0056] Next, embodiments of the present invention will be described with reference to the drawings. First, refer to figure 1 An electronic component mounting system 1 that manufactures a mounted substrate by mounting electronic components on a substrate will be described. exist figure 1 In the electronic component mounting system 1, each device of the printing device M1, the inspection and mounting device M2, the electronic component mounting device M3, M4, the inspection and mounting device M5, the substrate transfer device M6 and the reflow soldering device M7 is moved along the substrate conveying direction ( X direction) The main body is the electronic component installation line formed by linking. Each device constituting the electronic component mounting line is connected through a communication network 2 and controlled by a host device 3 having a management computer function. In this way, transmission of control commands from the host system and exchange of signals b...

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Abstract

The invention provides an appearance check device and an appearance check method, and check precision and quality can be ensured always by the invention. A shooting apparatus is used to shoot a clamp for correction; based on a measurement value for correction drawn from shot image information, in a correction structure in which a correction handling executor executes data for correction for storing, before displaying production start screen, check screen before production is displayed according to the correction message for correction order. Therefore, execution miss of correction caused by human fault like storage error made by the operators can be reliably prevented, and check precision of the appearance check device can be ensured, and check quality can be ensured.

Description

technical field [0001] The present invention relates to an appearance inspection device and an appearance inspection method. The appearance inspection device is arranged on an electronic component mounting line and performs a predetermined inspection based on image information obtained by photographing an inspection object. Background technique [0002] The component mounting line that mounts components on the substrate to manufacture the mounted substrate is composed of a plurality of devices such as a solder printing device, a component mounting device, and a reflow soldering device. When the device is heated, the solder is melted and solidified, and solder joint is performed. In this part mounting process, visual inspection is performed at each step in order to confirm whether the solder printing state, the part mounting state, and the final part joining state are correct or not. In this visual inspection, based on the image information obtained by photographing the boar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00G01B11/24
Inventor 伊藤克彦永井大介木下丰益宪司中村光男
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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