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Support structure and camera shooting module with support structure

A camera module and bracket structure technology, applied in image communication, camera body, color TV components and other directions, can solve the problem of poor camera module size and other issues

Inactive Publication Date: 2013-09-04
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a bracket structure and a camera module with the bracket structure for the problem of poor size of the camera module caused by glue overflow.

Method used

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  • Support structure and camera shooting module with support structure
  • Support structure and camera shooting module with support structure
  • Support structure and camera shooting module with support structure

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Embodiment Construction

[0028] The support structure and the camera module with the support structure will be described in detail below in conjunction with specific embodiments and drawings to make it more clear. However, the technical solutions of the bracket structure and the camera module with the bracket structure can be implemented in many different forms, and are not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the bracket structure and the camera module with the bracket structure more thorough and comprehensive.

[0029] Such as figure 1 with figure 2 As shown, a camera module includes a substrate 200 , an image sensing device 400 disposed on the surface of the substrate 200 , a lens driving assembly 300 and a bracket structure 100 .

[0030] Wherein, the substrate 200 is provided with a flexible circuit board; the lens driving assembly 300 includes a voice coil motor 310 and a lens 320 , the lens 320 i...

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Abstract

The invention relates to a support structure which comprises a first surface and a second surface which is oppositely arranged with the first surface. A lens driving assembly is installed on the first surface, the second surface is attached to a base plate, a glue fixing face is formed on at least one edge of the second surface, the glue fixing face is a plane or a curved face which is slant relative to the second surface, a gluing space is defined between the glue fixing face and the base plate, therefore, when the second surface of the support structure is connected with the base plate in a flush and gluing mode through a bonding agent, the arrangement of the glue fixing face enables the bonding space to be defined between the edge area of the second surface and the base plate, the bonding agent can be spilled to the bonding space, poor size quality caused by that fact that the bonding agent is spilled to the periphery of the support structure can be avoided, the support structure is to the benefit of guaranteeing accuracy of the appearance size of a camera shooting module, follow-up assembly can be conveniently carried out, and the yield of the camera shooting module is improved. In addition, a contact area among the bonding agent, the support structure and the base plate can be expanded, and therefore adhesive strength of the support structure and the base plate can be strengthened.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a bracket structure and a camera module with the bracket structure. Background technique [0002] With the development of science and technology, more and more portable electronic devices, such as mobile phones, notebook computers, personal digital assistants, etc., have integrated camera modules in order to combine camera functions. Camera modules are generally divided into fixed-focus camera modules and auto-focus camera modules. Among them, the auto-focus camera module has the advantage of being able to clearly shoot objects in a wide range, and has a high market share. [0003] At present, the auto-focus camera module generally installs the electronic components on the bracket, and then attaches the bracket with the electronic components to the substrate with the circuit board. During the lamination process of the existing bracket and the substrate, the adhesiv...

Claims

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Application Information

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IPC IPC(8): G03B17/12G02B7/02H04N5/225
Inventor 刘燕妮龚礼宗
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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