Modularized semiconductor processing device

Abstract

The invention discloses a modularized semiconductor processing device which comprises a semiconductor processing module, a fluid transmission module, a fluid bearing module and a control module. The semiconductor processing module comprises a micro-cavity used for containing and processing a semiconductor wafer. The micro-cavity comprises one or more inlets used for enabling fluid to enter the micro-cavity and one or more outlets used for enabling the fluid to be discharged from the micro-cavity. The fluid transmission module is used for enabling the unused fluid in different kinds to be driven to the micro-cavity through a pipeline and the inlets of the micro-cavity. The control module is used for controlling the semiconductor processing cavity and the fluid transmission module. The semiconductor processing device has the advantages of being small in size, simple in structure, convenient assemble, flexible in assembly, favorable for displacement of components and the like.

Description

【Technical field】 [0001] The invention relates to the field of semiconductor surface treatment, in particular to a modular semiconductor processing equipment for surface treatment of semiconductor wafers. 【Background technique】 [0002] At present, integrated circuits are gradually being applied to many fields, such as computers, communications, industrial control and consumer electronics. The manufacturing of integrated circuits has become a basic industry as important as steel. [0003] Wafers are the carriers used to produce integrated circuits. In actual production, the wafers that need to be prepared have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and processes such as Dry treatment process based on chemical vapor and plasma technology. Among them, the wet processing process is a relatively widely used method in the prior art. ...

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Problems solved by technology

[0004] However, the existing equipment for preparing ultra-clean wafer surfaces generally has the following disadvantages: 1. The structure is very complicated, the volume is relatively large, and the cost is also high; 2. Once these equipment fails, troubleshooting generally requires stopping the production line Production affects output; 3. Once the installation is completed, it is not easy to adjust and change the function and position; 4. It is inconvenient to carry

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