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Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method

A quartz wafer and sorting machine technology, applied in the field of quartz wafer thickness sorting and sorting, and quartz wafer thickness sorting machine, can solve problems such as large errors, improve the qualification rate, reduce the breakage rate, and reduce the probability of human contact with the wafer Effect

Active Publication Date: 2013-06-05
RES INST OF ZHEJIANG UNIV TAIZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing sorting method adopts the method of physical measurement, and the error is relatively large

Method used

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  • Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method
  • Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method
  • Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method

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Embodiment Construction

[0040] Such as figure 1 As shown, the quartz wafer thickness sorting machine with the function of discharging slices of the present invention includes a feeding module 1, a thickness measuring module 2, a sorting module 3, and a discharging module 5; Transfer to the thickness measurement module 2 to measure the thickness of the wafer; the sorting module 5 sorts the wafer into different magazines 6 according to the measurement results of the thickness measurement module 3; material.

[0041] Such as figure 2 As shown, the feeding module 1 includes a feeding motor 15, the output end of the feeding motor 15 is connected to the ball screw 13; the ball screw 13 is connected to the top sheet block 14 through a movable nut; the movable end of the top sheet block 14 is arranged on the film box 9; the film box 9 is fixedly arranged by the film box magnet and block 11; the top of the film box 9 is provided with an optical fiber module 10;

[0042] The feeding motor 15 drives the bal...

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Abstract

The invention discloses a quartz crystal wafer thickness sorting machine with a wafer arranging function. The quartz crystal wafer thickness sorting machine comprises a feeding module, a thickness measuring module, a sorting module and a discharging module. The feeding module delivers crystal wafers in place, and the crystal wafers are transferred by an upper electrode to the thickness measuring module to be subjected to thickness measurement. The sorting module sorts the crystal wafers into different material boxes according to measurement results of the thickness measuring module. A part of material boxes is connected with the discharging module. The crystal wafers in the part of material boxes are discharged through the discharging module. The quartz crystal wafer thickness sorting machine can achieve quartz crystal wafer full-automatic sorting and discharging functions, feeding, measurement, sorting and wafer arrangement are controlled by independent motors, the wafer thickness measuring speed can be remarkably improved, the quartz crystal wafer thickness sorting machine has the wafer arranging function after sorting, man-made wafer contact probability can be reduced, and wafer damage rate is reduced. The invention further discloses a quartz crystal wafer thickness sorting and wafer arranging method.

Description

technical field [0001] The invention relates to a semiconductor wafer processing equipment, in particular to a quartz wafer thickness sorter with the function of arranging wafers. The invention also relates to a thickness sorting and arranging method for quartz wafers. Background technique [0002] Thickness sorting of quartz wafers can effectively improve the yield of wafers. The existing sorting method adopts the method of physical measurement, and the error is relatively large. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a quartz wafer thickness sorting machine with the function of arranging slices, which can realize the functions of automatic sorting and automatic arranging of quartz wafers. [0004] In order to solve the above-mentioned technical problems, the technical solution of the quartz wafer thickness sorter with the function of arranging slices of the present invention is: [0005] Including f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/08B07C5/02B07C5/38
Inventor 王维锐刘木林王均晖张林友
Owner RES INST OF ZHEJIANG UNIV TAIZHOU
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