Patch type diode device structure

Abstract

The invention relates to a patch type diode device structure. The patch type diode device structure comprises a first lead strip, a second lead strip, a connecting piece and a diode chip which are arranged in an epoxy packaging body, wherein a first bending position is arranged in an area between a support area of the first lead strip and a pin area, so that the support area of the first lead strip is lower than the pin area; a second bending position is arranged in an area between a welding area of the second lead strip and the pin area, so that the welding area of the second lead strip is lower than the pin area; a third bending position is arranged between a first welding end and a second welding end of the connecting piece, so that the first welding end is lower than the second welding end; a protrusion portion with thickness smaller than that of the pin area is arranged on the lower surface of the epoxy packaging body; and a plurality of through holes are arranged between the third bending position and the second welding end. The patch type diode device structure eliminates the possibility that a pin suspension degree is below a lower limit, so that product yield loss caused by an ultra lower limit of a suspension degree value in case of unit abnormality and product abnormality caused by miss-judging are avoided.

Description

technical field [0001] The invention relates to a diode device, in particular to a chip diode device structure. Background technique [0002] Rectifiers use the unidirectional conduction characteristics of diodes to rectify alternating current, so they are widely used in circuits that convert alternating current into direct current. [0003] Existing semiconductor products with connecting piece structure usually limit the connecting piece with no limit or adopt a simple groove structure. The disadvantage is that the connecting piece can only be limited in one direction. The purpose of the limit is to avoid the connection during the welding process in the furnace. Chip offset causes the connection points on the connecting chip to deviate from the chip bonding area, resulting in electrical failure of the product. When the device design requires a higher-precision limit for the connecting piece, the existing structure cannot meet the requirements. The purpose of the limit is t...

AI Technical Summary

Problems solved by technology

During the molding process, injection molding pores are prone to appear inside the product. These pores can lead to electrical or reliability failure of the product. Therefore, how to develop a semiconductor packaging structure that is easy to locate and can solve the above problems has become the direction of efforts of those skilled in the art.

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