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Double-ultrasonic-high-frequency induction combined precision micro-connection device and method

A high-frequency induction and micro-connection technology, used in welding equipment, non-electric welding equipment, manufacturing tools, etc., can solve problems such as connection space limitations, reduce space limitations, avoid incomplete removal of insulating layers, and reduce production costs. Effect

Inactive Publication Date: 2013-05-01
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The application of these welding heads has successfully achieved the connection of some enameled wires (such as direct welding enameled wires), and the obtained solder joints have better performance, but for some enameled wires (such as polyesterimide enameled wires), this method There are still many problems
And this connection method is not suitable for single-sided welding, and the connection space is greatly limited

Method used

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  • Double-ultrasonic-high-frequency induction combined precision micro-connection device and method
  • Double-ultrasonic-high-frequency induction combined precision micro-connection device and method
  • Double-ultrasonic-high-frequency induction combined precision micro-connection device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Such as Figure 1 to Figure 7 As shown, a double ultrasonic-high frequency induction composite precision micro-connection method, the specific implementation steps are as follows:

[0065] (1) Start the power supply, and preset the connection parameters according to the material and size of the workpiece to be connected;

[0066] (2) Place the workpiece to be connected between the high-frequency induction self-heating head of the connection device and the worktable; ( image 3 a)

[0067] (3) The high-frequency induction self-heating head starts to descend from the initial position, and presses the workpiece to be connected with a predetermined pressure; ( image 3 b)

[0068] (4) When the pressure reaches the preset value, trigger the control end of the upper ultrasonic vibration system and high-frequency induction self-heating device, respectively make the ultrasonic vibration system and high-frequency induction self-heating head work, and input heat energy to the ...

Embodiment 2

[0084] In this embodiment, except for the following features, other structures and processes are the same as in Embodiment 1: the pressurization method is pneumatic pressurization.

[0085] In the step (1), the workpieces to be connected are aluminum wires and aluminum sheets respectively.

[0086] In the step (1), press Figure 8 The work shown requires preset connection parameters, the preset pressurization mode is the secondary loading mode, and the ultrasonic loading mode is the constant amplitude loading mode.

[0087] In the step (4), when the pressure reaches the preset value, the control terminals of the upper and lower ultrasonic vibration systems and the high-frequency induction self-heating device are triggered, and heat energy and two beams of ultrasonic waves are input to the joint to be connected to realize the control of the workpiece. Precision micro-joints. In this example, combined with Figure 8 pair connection phase (t 1 -t 4 ) are specified as follows...

Embodiment 3

[0092] In this embodiment, except the following features, other structures and processes are the same as in Embodiment 2:

[0093] In the step (1), press Figure 9 The work shown requires preset connection parameters.

[0094] In the step (4), when the pressure reaches the preset value, the control terminal of the upper ultrasonic vibration system and the high-frequency induction self-heating device is triggered, and heat energy and ultrasonic waves are input to the joint to be connected to realize precise micro-connection of the workpiece. In this example, combined with Figure 9 For the time period t in the connection phase 3 -t 5 The specific instructions are as follows:

[0095] time period t 3 -t 4 : Enter the secondary loading stage, the pressure increases to F 2 . with t 1 -t 3 After the connection work is completed, the contact area becomes larger and larger, and the joint is basically formed.

[0096] time period t 3 -t 4 : The ultrasonic vibration system...

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Abstract

The invention discloses a double-ultrasonic-high-frequency induction combined precision micro-connection device, which comprises a rack, a driving mechanism, a transmission mechanism, an upper ultrasonic vibration system, a high-frequency induction self-heating device, a lower ultrasonic vibration system, a workbench and a power supply, wherein the driving mechanism and the transmission mechanism are arranged on the rack; the upper ultrasonic vibration system is connected with the transmission mechanism; the high-frequency induction self-heating device is connected with the output end of the upper ultrasonic vibration system; the lower ultrasonic vibration system is arranged below the upper ultrasonic vibration system; the workbench is arranged above the lower ultrasonic vibration system; and the upper ultrasonic vibration system, the high-frequency induction self-heating device and the lower ultrasonic vibration system are connected with the power supply. According to the device, dual-ultrasonic vibration and heat energy are combined, so that the phenomenon that a workpiece to be connected is fused or damaged by over-temperature when only the heat energy is used is avoided, the problems of high unsoldering rate and incomplete insulating layer removal of ordinary ultrasonic hot pressure welding are also solved, the working efficiency is improved, and the production cost is lowered. In addition, the invention also discloses a method for performing double-ultrasonic-high-frequency induction combined precision micro-connection by adopting the device.

Description

technical field [0001] The invention relates to a micro-connection device and method, in particular to a dual-ultrasonic-high-frequency induction compound precision micro-connection device and method. Background technique [0002] Enameled wire is widely used in the production of electronics, electrical, medical appliances and semiconductors (such as sensors, transformers, coils, windings, implanted electrodes, chip interconnection leads, etc.), as part of the internal basic components, or as a conductor medium for internal and external connections of components . When used as a medium for internal and external connections, the end of the enameled wire must be in electrical contact with metal terminals (such as inserts, pins, foils, etc.), and meet certain requirements for mechanical properties, electrical conductivity, and temperature cycle fatigue resistance. Therefore, in the production of electronic components, medical equipment, sensors and other products, precision mi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/10B29C65/08
CPCB29C65/08B29C65/081B29C65/082B29C65/088B29C65/18B29C65/32B29C65/72B29C66/1122B29C66/43B29C66/474B29C66/8246B29C66/8322B29C66/91216B29C66/91221B29C66/9515
Inventor 郭钟宁袁聪李远波张永俊邓宇黄志刚
Owner GUANGDONG UNIV OF TECH
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