High-adaptability uniform film formation method and device for nanomaterial on substrate

Abstract

The invention discloses a high-adaptability uniform film formation method for a nanomaterial on a substrate. The method comprises the steps of preparing nanomaterial mixed liquid or a nanomaterial solution, producing a carrier gas flow field, forming atomized nanomaterial drops, and allowing the carrier gas flow field to drive the atomized nanomaterial drops to be sprayed onto the surface of the substrate vertically and upwards. The invention further discloses a high-adaptability uniform film formation device for the nanomaterial on the substrate. The device comprises a liquid sampling container, an ultrasonic atomizer, an ascending air flow generator and a system state controller. The uniform carrier gas flow field can be produced to realize uniform atomized drop flow, the covering uniformity of the atomized drops on the surface of the substrate is greatly improved, the film formation uniformity of the nanomaterial is improved, and the film formation thickness can be better controlled. In addition, the method and the device have high adaptability to factors such as an operational environment, the substrate type and the nanomaterial type.

Description

technical field [0001] The invention relates to a material preparation method in the field of material processing and preparation and in the field of micro-processing technology, in particular to a film-forming method and a device for homogenizing nanoparticles with strong adaptability to substrates. Background technique [0002] Nanomaterials have broad application prospects in many aspects, among which, the application of nanoparticles and one-dimensional nanomaterials is especially valued by the academic and business circles. Nanoparticles are particles with a scale ranging from a few nanometers to hundreds of nanometers, also known as zero-dimensional nanomaterials. One-dimensional nanomaterials are linear, tubular, and rod-shaped nanostructured functional materials with large aspect ratios and super-large aspect ratios. Typical one-dimensional nanomaterials include zinc oxide nanorods, gold nanowires, silicon nanowires, Silicon carbide nanowires, carbon nanotubes, etc....

AI Technical Summary

Problems solved by technology

However, this technology has the following obvious limitations: First, it is impossible to print many nanomaterials that are difficult to form a slurry, such as nanoparticles, high-density nanorods, etc.; second, subsequent desolvation treatment is required after printing , usually at a high temperature above 300 degrees Celsius, it is impossible to print on many substrates with poor high-temperature characteristics, or substrates with precision structures on the surface; The uniform distribution in the material, its thickness uniformity is subject to the process parameters of the printing process, there is no report of the process parameters that can achieve a wide range of uniform distribution

Yet the defect of this method is: the first, in many cases need to select specific solvent in order to realize this process, and will carry out certain surface treatment to substrate, also must carry out surface treatment to it for some nanomaterials, Therefore, many harsh restrictions are put forward on the adaptability of the substrate and the compatibility of nanomaterials, which are not applicable in many applications; second, the quality of film formation is highly dependent on the control of the relative motion of the substrate and the liquid surface. The need for a multi-layer film, or a thicker film, will greatly increase the cost and seriously affect the cost control of related technologies; third, it is very sensitive to the fluctuation of the substrate surface, making it difficult to apply nanostructures that need to cover the existing In the fabrication process of devices with microstructures on the substrate surface

This technology has the following limitations: First, not all nanoparticles can find a suitable solvent to dissolve them, and then the thin film of this substance can be re-formed on the substrate by low-temperature heating, for example, almost all Metal nanoparticles, so its application range is very limited; second, even if some substances can form a solution and form a film on the surface of the substrate, they may not be able to crack into nanoparticles, so their application range is further limited; third , since the spraying process is simply to spray the carrier gas with the solvent onto the substrate, the size of the droplets reaching the surface of the substrate is bound to be very uneven, so no matter in the thickness direction or in the direction parallel to the surface, It is difficult to form a uniform distribution of nanoscale thin layer structures

However, due to the need to complete the process steps in a combustion flame environment, this method cannot form films on various substrates, especially difficult to form films on the surface of substrates that have already produced microstructures.

This method also introduces new nano-impurities such as carbon nanoparticles, and requires vacuum equipment, which has the problems of complex devices and high costs.

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