Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chamfering machine capable of processing non-standard silicon wafer

A technology of chamfering machine and silicon wafer, applied in the field of chamfering machine, can solve the problem of not being able to process non-standard silicon wafers, etc., and achieve the effect of improving production and processing capacity and increasing processing capacity

Active Publication Date: 2013-03-13
ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The processing of silicon wafers generally requires the use of chamfering equipment. With the increasing application of non-standard silicon wafers, the existing chamfering machines need to have a certain ability to process non-standard silicon wafers. D37-378 / YL domestic chamfering The machine is mainly used for the edge processing of semiconductor silicon wafers, which can automatically realize accurate chamfering, but there is a technical problem that it does not have the ability to process non-standard silicon wafers with a diameter less than 73mm

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chamfering machine capable of processing non-standard silicon wafer
  • Chamfering machine capable of processing non-standard silicon wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Such as figure 1 As shown, the present invention includes a regularization system, and the regularization system includes a sheet-feeding arm 5, and one end of the sheet-feeding arm 5 is provided with a circular suction piece 4, and the diameter of the suction piece 4 is 35mm; the suction piece 4 is also equipped with Two arch-shaped regular splints 1, each of the two ends of the regular splint 1 is provided with a bar-shaped positioning block 2, and one end of the positioning block 2 is fixed on the described regular splint 1 by a shaft, The angle of the positioning block 2 can be adjusted according to actual processing needs, and the other end of the positioning block 2 is provided with a positioning wheel 3 .

[0017] The invention also includes a processing system comprising a workbench such as figure 2 As shown, the workbench is provided with an upper clip 6 and a lower clip 7 for clamping the workpiece, the upper clip 6 is cylindrical, with a diameter of 35 mm a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides a chamfering machine capable of processing a non-standard silicon wafer. The chamfering machine comprises a correcting system, wherein the correcting system comprises a wafer conveying arm; a round wafer absorption head is arranged at one end of the wafer conveying arm; the wafer absorption head is provided with two arch-shaped correcting clamp plates; strip-shaped positioning blocks are arranged at the two ends of each correcting clamp plate; one end of each positioning block is fixed to each correcting clamp plate through a shaft; each positioning block can be used for adjusting an angle according to the practical processing need; and a positioning wheel is arranged at the other end of each positioning block. The chamfering machine has the benefits as follows: the processing capability of the non-standard silicon wafer is improved under the condition that the original processing capability of equipment is maintained, so that the production and processing capabilities of the equipment are improved.

Description

technical field [0001] The invention relates to a chamfering machine, in particular to a chamfering machine capable of processing non-standard silicon wafers. Background technique [0002] The processing of silicon wafers generally requires the use of chamfering equipment. With the increasing application of non-standard silicon wafers, the existing chamfering machines need to have a certain ability to process non-standard silicon wafers. D37-378 / YL domestic chamfering The machine is mainly used for the edge processing of semiconductor silicon wafers, which can automatically realize accurate chamfering, but there is a technical problem that it does not have the ability to process non-standard silicon wafers with a diameter less than 73mm. Contents of the invention [0003] The problem to be solved by the present invention is to provide a chamfering machine capable of processing non-standard silicon wafers. [0004] In order to solve the above technical problems, the techni...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/06B28D5/00B28D7/04
Inventor 雷海云张雪囡耿辉古元甲郭红慧邢玉军
Owner ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com