Tin dipped baseboard for glass sealed diode

Abstract

The invention discloses a tin dipped baseboard for a glass sealed diode. The tin dipped baseboard is composed of a substrate, magnetic strips and a panel, wherein the substrate is a non-magnetic metal board and is provided with a plurality of parallel distributed slots; the magnetic strips are disposed in the slots; and the panel is a metal board having a good magnetic conductive performance, and covers and is fixed on the upper surface of a concave platform. The baseboard disclosed in the invention solves an extremely-severe economic loss problem of a production enterprise, and is a good substitute of baseboards in the prior art, wherein the problem is caused by of a tin dipped baseboard which is a plastic magnetic board, has the disadvantages of short service life, easy damage and unstable magnetic force and is used in the prior art.

Description

Technical field: [0001] The invention relates to the diode manufacturing industry, in particular to an immersion-tin base plate for glass-encapsulated diodes. technical background: [0002] Glass-encapsulated diode is an industry term in the diode manufacturing industry. It means to use a glass tube to encapsulate the diode core. When glass-encapsulating diodes, there is a tin-immersed process. This process requires the use of what is called a "tin plate" in the industry Special tools are used to position the diodes to ensure that several diode dies and their leads placed on the "dipping board" are dipped in one time. [0003] The above-mentioned "tin plate" is composed of a middle plate and a bottom plate. The middle plate is a metal plate provided with a number of small holes, and the small holes are used to place glass tubes and diode cores; the bottom plate is connected to the lower surface of the middle plate with a Magnetic object, its function is to absorb and place ...

AI Technical Summary

Problems solved by technology

[0006] 2. The bottom plate is easily scratched by the diode pins during use, and the scratched plastic magnetic sheet will cause the diode pins to be bent during the blanking operation, resulting in two lead wires during the second immersion tin. The feet are bonded together by melting tin. According to statistics, this phenomenon causes at least 2% waste of raw materials for enterprises.

[0009] 1. Because the service life of the bottom plate is not long, the enterprise needs to spend about 20,000 yuan per month for the replacement of the bottom plate;

[0010] 2. Due to the above-mentioned 3 deficiencies, the enterprise caused about 120,000 material losses per month

[0011] It can be seen that the base plate of the prior art has three problems of short service life, easy damage and unstable magnetic force, which not only cause extremely serious economic losses to the production enterprise, but also are not conducive to the realization of the national "energy saving and consumption reduction" production policy. The industry urgently needs a new bottom plate to replace it

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