On-line SPM generating system and control method thereof

Abstract

A system for online SPM generation and control method thereof, which relate to the method or device that is specially suitable for manufacturing or processing semiconductor or solid apparatus or the component thereof, especially suitable for the processing for the release agent of photoresist material in integrated circuit technology, comprising an H2SO4 supplying unit, an H2O2 supplying unit, an SPM mix spraying unit and a control unit. The SPM mix spray unit comprises an SPM mix element and an SPM spray head. The SPM mix element comprises at least two input ends and an SPM output end. An H2SO4 flow control element is connected to the first input end of the SPM mix element by an H2SO4 pipeline. An H2O2 flow control element is connected to the second input end of the SPM mix element by an H2O2 pipeline. The SPM output end of SPM mix element is connected to the SPM spray head. The said system has the advantages of high control precision, a stable flow value, an accurate mix ratio of generating SPM mixed liquid, and a wide adjusting range. Therefore it is ensure that the active range of the SPM mixed solution is wide and is suitable for all different kinds of cleaning technological requirements.

Description

technical field [0001] The present invention relates to a method or equipment specially suitable for manufacturing or processing semiconductor or solid device or parts thereof, especially suitable for the treatment of stripping agent of photoresist material in integrated circuit technology. Background technique [0002] In the manufacturing process of semiconductors, integrated circuits, photovoltaic products and other electronic products, it is necessary to perform photolithography on various substrates represented by semiconductor wafers and photomasks. These substrates also include liquid crystal displays, glass substrates for plasma displays, and optical disc masters. Plates, magnetic disks, optical disk masters, etc., hereinafter collectively referred to as substrates. It is necessary to use photoresist material (photoresist) to form layout patterns of integrated circuits and semiconductor devices or other circuit patterns and data patterns on the substrate. After the ...

AI Technical Summary

Problems solved by technology

[0004] The mixing ratio, activity, temperature of the SPM mixture, as well as the spraying method and flow rate of SPM have a crucial impact on the quality and efficiency of substrate treatment. Improper treatment will cause critical dimension loss and surface materials due to corrosion of the chemical solution. The light reflectance of ruthenium (Ru) is reduced, which may be a fatal injury for high-end semiconductor processes of 32nm and above

However, the above-mentioned patents and patent applications do not provide effective technical solutions for the control of the mixing ratio, activity, temperature, and spraying mode and spraying flow rate of SPM.

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