Multi-wire cutting machine

Abstract

The invention discloses a multi-wire cutting machine capable of reducing height of a wire bow. The multi-wire cutting machine comprises a machine frame, metal wires and two wire rollers arranged on the machine frame in parallel. The surface of each wire roller is provided with a plurality of annular wire grooves, the metal wires are arranged in the annular wire grooves and successively bypasses the two wire roller to be tightened, and an auxiliary supporting roller for supporting the metal wires is arranged between the two wire rollers. The auxiliary supporting roller for supporting the metal wires is arranged between the two wire rollers, thereby greatly reducing height of the wire bow of the metal wire, further reducing cutting distance of a silicon rod, shortening required time in cutting the silicon rod, and improving cutting efficiency. Moreover, the number of silicon rods cut by one metal wire can be greatly increased, usage amount of the metal wires is reduced, and production cost is lowered. Besides, line marks left on cut silicon piece surfaces by the metal wires can be greatly reduced, thereby improving quality of silicon pieces. The multi-wire cutting machine is suitable for being popularized and applied to the cutting equipment field.

Description

technical field [0001] The invention relates to the field of cutting equipment, in particular to a multi-wire cutting machine for cutting silicon rods into silicon wafers. Background technique [0002] At present, silicon wafers used for solar cells are mostly produced by multi-wire cutting machines. The existing multi-wire cutting machines include a frame, steel wires, and two wire rollers arranged in parallel on the frame. An annular wire groove, the steel wire is set in the annular wire groove and passed around two wire rollers successively to tighten, the area between the two wire rollers is the cutting area, and the center distance between the two wire rollers is 600mm, due to the two wire rollers The distance between the wire rollers is longer, so that the span of the cutting area is larger. Therefore, the multi-wire cutting machine can cut two silicon rods at the same time, and the two silicon rods are arranged side by side. However, although this multi-wire cutting m...

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Problems solved by technology

[0002] At present, silicon wafers used for solar cells are mostly produced by multi-wire cutting machines. The existing multi-wire cutting machines include a frame, steel wires, and two wire rollers arranged in parallel on the frame. An annular wire groove, the steel wire is set in the annular wire groove and passed around two wire rollers successively to tighten, the area between the two wire rollers is the cutting area, and the center distance between the two wire rollers is 600mm, due to the two wire rollers The distance between the wire rollers is longer, so that the span of the cutting area is larger. Therefore, the multi-wire cutting machine can cut two silicon rods at the same time, and the two silicon rods are arranged side by side. However, although this multi-wire cutting machine can simultaneously Cutting two silicon rods, however, the larger span of the cutting area will bring some other problems, for example, when cutting silicon rods, the bow height of the steel wire is relatively large, about 10mm, and the steel wire will be affected when cutting silicon rods. The force of pressing down the silicon rod, and then deviate from the original position. The wire bow height refers to the maximum distance that the steel wire deviates when cutting the silicon rod. Since the wire bow height is relatively large when cutting the silicon rod, when the steel wire is cut to When the silicon rod is glued to the surface, the outer side of the two silicon rods will be cut through first, and then the inner side will be cut through. The outer side of the silicon rod refers to the side close to the wire roller. To cut through, you need to cut at least 10mm more, which makes the time required to cut silicon rods longer, and the cutting efficiency is lower. At the same time, the number of silicon rods that can be cut by one steel wire is less, and the cost is higher. , when the steel wire cuts through the silicon rod, it will cut to the outside of the glass used to fix the silicon wafer. After the steel wire cuts the glass, some silicon dioxide particles will adhere to the surface of the steel wire. Good silicon wafers leave obvious line marks on the surface, which affects the quality of silicon wafers. At the same time, steel wires are easily worn and broken when cutting glass, resulting in greater loss of steel wires and increased costs.

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