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Dual-curing orthodontic treatment adhesion resin

A bonding resin and dual-curing technology, which is applied in dental preparations, dental prostheses, molding cups, etc., can solve the problems of increased enamel damage, poor long-term bonding strength of brackets, and blockage of visible light transmission. achieve precise treatment

Inactive Publication Date: 2012-09-19
李军 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the main disadvantage of light-curing adhesive resins is that when metal brackets are used in orthodontic treatment, the brackets block the transmission of visible light that can promote the photopolymerization of the orthodontic resin at the bottom of the brackets.
Therefore, it is impossible for the orthodontist to confirm that the resin at the bottom of the metal bracket has been fully cured, and the insufficient polymerization of the resin at the bottom of the bracket will lead to poor long-term bonding strength of the bracket; Increased chance of enamel damage

Method used

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  • Dual-curing orthodontic treatment adhesion resin
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  • Dual-curing orthodontic treatment adhesion resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: A dual-cure orthodontic adhesive resin is characterized in that it consists of paste A and paste B;

[0036] Said paste A consists of Bis-GMA, HEMA, 4-MET, PEM-F, CB-1, camphorquinone and glass powder;

[0037] Wherein, the content of Bis-GMA is 4.5wt%, the content of HEMA is 27.5wt%, the content of 4-MET is 16.5wt%, the content of PEM-F is 22.5wt%, the content of CB-1 is 15.5wt%, The content of camphorquinone is 0.005wt%, and the content of glass powder is 13.495wt%;

[0038] Said paste B is made of Bis-GMA, TEGDMA, DMAEMA, p-TSNa and glass powder;

[0039] Wherein, the content of Bis-GMA is 54.5wt%, that of TEGDMA is 38.5wt%, that of DMAEMA is 0.03wt%, that of p-TSNa is 0.03wt%, and that of glass powder is 6.94wt%.

Embodiment 2

[0041] A dual-cure orthodontic bonding resin is characterized in that it consists of paste A and paste B;

[0042] Said paste A consists of Bis-GMA, HEMA, 4-MET, PEM-F, CB-1, benzophenone and silicon dioxide;

[0043] Among them, the content of Bis-GMA is 4.6wt%, the content of HEMA is 27.85wt%, the content of 4-MET is 17wt%, the content of PEM-F is 29.5wt%, the content of CB-1 is 10.5wt%, benzophenone The content of silicon dioxide is 0.05wt%, and the content of silicon dioxide is 10.5wt%;

[0044] Said paste B consists of Bis-GMA, TEGDMA, p-TDEA, p-TSNa and silicon dioxide;

[0045] Among them, the content of Bis-GMA is 61.5wt%, the content of TEGDMA is 30.5wt%, the content of p-TDEA is 0.09wt%, the content of p-TSNa is 0.09wt%, and the content of silicon dioxide is 7.82wt%.

Embodiment 3

[0047] A dual-cure orthodontic bonding resin is characterized in that it consists of paste A and paste B;

[0048] Said paste A consists of Bis-GMA, HEMA, 4-MET, PEM-F, CB-1, acetophenone and fumed silica;

[0049] Among them, the content of Bis-GMA is 4.7wt%, the content of HEMA is 31.5wt%, the content of 4-MET is 16.7wt%, the content of PEM-F is 22.6wt%, the content of CB-1 is 10.99wt%, The content of acetophenone is 0.01wt%, and the content of fumed silica is 13.5wt%;

[0050] Said paste B consists of Bis-GMA, TEGDMA, p-TDEA, p-TSNa and fumed silica;

[0051] Among them, the content of Bis-GMA is 55.4wt%, the content of TEGDMA is 32.5wt%, the content of p-TDEA is 0.04wt%, the content of p-TSNa is 0.06wt%, and the content of fumed silica is 12wt%.

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Abstract

The invention discloses dual-curing orthodontic treatment adhesion resin. The dual-curing orthodontic treatment adhesion resin is characterized by consisting of paste A and paste B; the paste A consists of bisphenol A glycidyl dimethacrylate, 2-hydroxyethyl methacrylate, 4-methacryloyloxyethyl trimeritate, penta-cyclophosphazene mono-fluoride, beta-methacryloyloxyethyl hydrogen phthalate, a photoinitiator and inorganic packing; and the paste B consists of bisphenol A glycidyl dimethacrylate, triethylene glycol dimethacrylate, an amine activator, sodium p-toluenesulfinate and inorganic packing. The dual-curing orthodontic treatment adhesion resin has the advantages that hardening time of the resin is controllable; initial adhesion strength of a supporting groove is high; and adhesion resin at the bottom of the supporting groove is polymerized sufficiently.

Description

(1) Technical field: [0001] The invention relates to the technical field of biomedical polymer materials, in particular to a dual-cure orthodontic adhesive resin. (two) background technology: [0002] Since Buonocore introduced acid etching technology into orthodontic bracket bonding, it has greatly promoted the development of various types of bonding techniques and orthodontic bonding resins. Because the orthodontist begins orthodontic treatment soon after bonding the brackets, the hardening time of the bonding resin and the initial bond strength are important. [0003] Currently, according to the curing type, orthodontic bonding resins can be divided into three types: 1) chemical curing bonding resins, 2) light curing bonding resins, and 3) dual curing bonding resins (including light curing and chemical curing systems). [0004] The traditional clinical chemical curing adhesive resin has the advantages of simple operation and low cost. Internationally, 4-methacryloyloxye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61K6/083A61K6/027C08F222/20C08F220/28C08F220/18
Inventor 李军
Owner 李军
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