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Test evaluation method of LED (light emitting diode) packaging adhesive

A technology of LED packaging and evaluation method, applied in the field of testing to achieve cost-saving effect

Active Publication Date: 2014-04-30
XIAMEN HUALIAN ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The applicant proposes a test method to test the performance of the LED encapsulant for the deficiencies of the existing LED test, especially for the performance of the LED encapsulant cured under the specific curing conditions of the LED encapsulant in the encapsulation process. and evaluation, so that the influence of LED packaging glue factors on the LED packaging process can be analyzed to provide technical guidance for LED product development

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  • Test evaluation method of LED (light emitting diode) packaging adhesive
  • Test evaluation method of LED (light emitting diode) packaging adhesive
  • Test evaluation method of LED (light emitting diode) packaging adhesive

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Embodiment Construction

[0020] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0021] The test and evaluation method of LED packaging glue of the present invention specifically comprises the steps:

[0022] Step S1: dispensing and curing to form an LED encapsulation film, and preparing an LED encapsulation film to be tested. The curing conditions of the LED encapsulation film here are exactly the same as the curing conditions of the LED product in the encapsulation process, so that the test of the LED encapsulation film is equivalent to the performance of the LED encapsulation film under this encapsulation process, so that the test results The performance data of LED encapsulant has high reference significance.

[0023] Among them, in step S1, the LED packaging film to be tested is formed by dispensing and curing, which can be made by conventional methods such as dispensing equipment, spraying equipment, mechanical cutting, et...

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Abstract

The invention relates to a test method and particularly a test method of materials. A test evaluation method of an LED (light emitting diode) packaging adhesive comprises the following steps of: step S1, dispensing and solidifying adhesive to form an LED packaging adhesive film, and preparing an LED packaging adhesive film to be tested; step S2, carrying out light transmittance performance test and other physical property tests on the LED packaging adhesive film; step S3, irradiating the LED packaging adhesive film through a lighting emitting device for light energy shock; step S4, carrying out light transmittance performance test and other physical property tests on the LED packaging adhesive film which is subjected to the energy shock in the step S3; and step S5, comparing and analyzing the test result obtained by the step S2 and the test result obtained by the step S4. The test method provided by the invention can be used for performance test of the LED packaging adhesive.

Description

technical field [0001] The invention relates to a testing method, in particular to a testing method for materials. Background technique [0002] The LED packaging process has an important impact on LED products. Among them, the most influential ones in the LED packaging process are the packaging structure and the selection and deployment of packaging glue. LED packaging manufacturers must conduct a large number of performance tests on LEDs during the development of an LED product or after molding. Since LED chips are generally purchased, the chip manufacturer has completed the performance test of the chip, so the test of the LED packaging manufacturer is generally aimed at the test of the LED packaging process. In the prior art, LED tests are generally carried out with designed and developed LED samples. Although such a test method is very intuitive, it has disadvantages: each time a sample needs to be made before testing, and at the same time, corresponding LED drive, as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/25
Inventor 陈联鑫李小红柴储芬
Owner XIAMEN HUALIAN ELECTRONICS CO LTD
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