Device and method for measuring dynamic elasticity modulus in temperature environment

Abstract

The invention discloses a device and a method for measuring dynamic elasticity modulus in the temperature environment. The technical scheme of the device includes that a beam-shaped test piece is clamped on a fixed rigidity table in a manner of a cantilever state with one end fixed and the other end free; by the aid of a resistance heating device, a thermocouple feeds back temperature and a temperature controller controls heating and temperature of the test piece, a piezoelectric ceramic vibration exciter mounted on the test piece receives excitation signals amplified by a signal amplifier toexcite the test piece, a laser vibration measurer performs modal tests on the test piece in the temperature environment, a computer receives signals of the laser vibration measurer, acquires fixed frequency and modal of each step in the controlled temperature environment through signal analysis and calculates dynamic elasticity modulus of materials in the controlled temperature environment by tested fixed frequency according to the relation between the fixed frequency and the elasticity modulus. The device has the advantages of nondestructive testing, convenience in use and operation, high measuring accuracy and the like.

Description

technical field [0001] The invention relates to the field of elastic modulus measurement, in particular to a measuring device and a measuring method for measuring dynamic elastic modulus in a temperature environment, which are used for measuring dynamic elastic modulus in a temperature environment. Background technique [0002] The elastic modulus E is an important index in the mechanical properties of materials, and it is a scale that characterizes the ability of solid materials to resist deformation. From a microscopic point of view, it is the reaction of the bond strength between atoms, ions or molecules. The modulus of elasticity cannot be measured directly, but needs to be calculated indirectly after measurement. With the development of science and technology, the working environment of materials is also more complicated. In engineering design, only considering the elastic modulus of materials in normal temperature environment can no longer meet the engineering require...

AI Technical Summary

Problems solved by technology

[0004] (2) It is difficult to control the temperature when measuring the elastic modulus by the static method, and there are certain difficulties in measuring the elastic modulus under the temperature environment;

[0005] (3) There are limitations in the measurement of the macroscopically equivalent elastic modulus of heterogeneous materials, and there are limitations in the measurement of brittle materials;

At present, there is no effective, simple and easy-to-operate measurement system for measuring dynamic elastic modulus under temperature environment in China

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