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Method for manufacturing gold finger circuit board

A circuit board production and gold finger technology, which is applied in the field of gold finger circuit board production, can solve the problems of gold finger electrical parameter changes, short circuits, etc., and achieve the effect of improving aesthetics, good effect, and ensuring reliability

Active Publication Date: 2012-04-25
SHENZHEN WUZHU TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The residue of the plating lead 13 will lead to changes in the electrical parameters of the gold finger, and even cause a short circuit due to the plating lead during the plug-in process.

Method used

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  • Method for manufacturing gold finger circuit board
  • Method for manufacturing gold finger circuit board
  • Method for manufacturing gold finger circuit board

Examples

Experimental program
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Embodiment Construction

[0028] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] Before the gold finger is electroplated, it is necessary to use the electroplating lead wire to electrically connect and conduct each gold finger pattern, and then use the electroplating method to plate gold on the gold finger pattern through the electroplating lead wire, and finally form a gold finger with a gold layer.

[0030] Please refer to image 3 and Figure 4 , image 3 It is a three-dimensional structural schematic diagram of the manufacturing process of the golden finger circuit board applicable to the present invention, Figure 4 for along image 3 The schematic diagram of the cross-sectional structure of line A-A is shown. The golden finger circuit board includes a substrate 20, a circuit 21 disposed on the substrate 20, and a plurality of golden fingers 22 electrically connected to the circuit 21 through internal or ex...

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Abstract

The invention relates to a method for manufacturing a gold finger circuit board. The method comprises the following steps of: providing a first laminate, forming a gold finger on a first side of the first laminate, and forming an electroplating lead corresponding to the gold finger on a second side of the first laminate; forming metalized copper cylinders in the first laminate, wherein each gold finger is electrically connected to the corresponding electroplating lead through a plurality of the metalized copper cylinders; electroplating the gold finger through the electroplating lead; and removing the redundant first laminate and electroplating lead. The gold finger circuit board manufactured by the circuit board manufacturing method has the advantages of attractive appearance and high electrical reliability.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a circuit board with golden fingers. Background technique [0002] Printed Circuit Board (PCB) is the basis of almost any electronic product and appears in almost every electronic device. Generally speaking, if there are electronic components in a certain device, they are also integrated on PCBs of various sizes. [0003] In addition to fixing various components, the main function of PCB is to provide connection circuits between various components. As electronic equipment becomes more and more complex, more and more components are required, and the lines and components on the surface of the PCB are becoming more and more dense. [0004] Some circuit boards need to be equipped with long and short gold fingers due to the need for connection interfaces. The gold fingers are composed of many golden-yellow conductive contacts. Because the surfa...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 徐学军
Owner SHENZHEN WUZHU TECH
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